On Mon, Sep 12, 2022 at 02:20:48PM +0530, Bhupesh Sharma wrote: > Add qcom,qmi-tmd-device and qcom,tmd-device yaml bindings. Looks like a duplicate of $subject. > > Qualcomm QMI based TMD cooling device(s) are used for various What is "TMD" an abbreviation of? > mitigations for remote subsystem(s) including remote processor > mitigation, rail voltage restriction etc. > > Each child node represents one remote subsystem and each child > of this subsystem in-turn represents separate TMD cooling device. > > Cc: daniel.lezcano@xxxxxxxxxx > Cc: rafael@xxxxxxxxxx > Cc: andersson@xxxxxxxxxx > Cc: robh@xxxxxxxxxx > Signed-off-by: Bhupesh Sharma <bhupesh.sharma@xxxxxxxxxx> > --- > .../bindings/thermal/qcom,qmi-tmd-device.yaml | 78 +++++++++++ > .../bindings/thermal/qcom,tmd-device.yaml | 122 ++++++++++++++++++ > include/dt-bindings/thermal/qcom,tmd.h | 14 ++ > 3 files changed, 214 insertions(+) > create mode 100644 Documentation/devicetree/bindings/thermal/qcom,qmi-tmd-device.yaml > create mode 100644 Documentation/devicetree/bindings/thermal/qcom,tmd-device.yaml > create mode 100644 include/dt-bindings/thermal/qcom,tmd.h > > diff --git a/Documentation/devicetree/bindings/thermal/qcom,qmi-tmd-device.yaml b/Documentation/devicetree/bindings/thermal/qcom,qmi-tmd-device.yaml > new file mode 100644 > index 000000000000..dfda5b611a93 > --- /dev/null > +++ b/Documentation/devicetree/bindings/thermal/qcom,qmi-tmd-device.yaml > @@ -0,0 +1,78 @@ > +# SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause) > + > +%YAML 1.2 > +--- > +$id: "http://devicetree.org/schemas/thermal/qcom,qmi-tmd-device.yaml#"; > +$schema: "http://devicetree.org/meta-schemas/core.yaml#"; > + > +title: Qualcomm QMI based thermal mitigation (TMD) cooling devices. > + > +maintainers: > + - Bhupesh Sharma <bhupesh.sharma@xxxxxxxxxx> > + > +description: > + Qualcomm QMI based TMD cooling device(s) are used for various > + mitigations for remote subsystem(s) including remote processor > + mitigation, rail voltage restriction etc. > + > +properties: > + $nodename: > + const: qmi-tmd-devices > + > + compatible: > + items: > + - const: qcom,qmi-tmd-devices > + > + modem0: > + $ref: /schemas/thermal/qcom,tmd-device.yaml# > + > + adsp: > + $ref: /schemas/thermal/qcom,tmd-device.yaml# > + > + cdsp: > + $ref: /schemas/thermal/qcom,tmd-device.yaml# > + > + slpi: > + $ref: /schemas/thermal/qcom,tmd-device.yaml# > + > +required: > + - compatible > + > +unevaluatedProperties: false > + > +examples: > + - | > + #include <dt-bindings/thermal/qcom,tmd.h> > + qmi-tmd-devices { Looking at the implementation I see no relationship between the individual instances (i.e. between the children of this node). My suggestion is that you drop this top-level node and just list out modem, adsp etc individually - which would mean that you can remove one layer of indirection in the driver, as each instance would just need a list of cooling-devices. > + compatible = "qcom,qmi-tmd-devices"; > + > + modem0 { So you would move the compatible here. > + qcom,instance-id = <MODEM0_INSTANCE_ID>; > + > + modem0_pa: tmd-device0 { > + label = "pa"; > + #cooling-cells = <2>; > + }; > + > + modem0_proc: tmd-device1 { > + label = "modem"; > + #cooling-cells = <2>; > + }; > + > + modem0_current: tmd-device2 { > + label = "modem_current"; > + #cooling-cells = <2>; > + }; > + > + modem0_skin: tmd-device3 { > + label = "modem_skin"; > + #cooling-cells = <2>; > + }; > + > + modem0_vdd: tmd-device4 { > + label = "cpuv_restriction_cold"; > + #cooling-cells = <2>; > + }; > + }; > + }; > +... > diff --git a/Documentation/devicetree/bindings/thermal/qcom,tmd-device.yaml b/Documentation/devicetree/bindings/thermal/qcom,tmd-device.yaml > new file mode 100644 > index 000000000000..38ac62f03376 > --- /dev/null > +++ b/Documentation/devicetree/bindings/thermal/qcom,tmd-device.yaml > @@ -0,0 +1,122 @@ > +# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause) > + > +%YAML 1.2 > +--- > +$id: "http://devicetree.org/schemas/thermal/qcom,tmd-device.yaml#"; > +$schema: "http://devicetree.org/meta-schemas/core.yaml#"; > + I see no reason for splitting this into a separate binding. > +title: Qualcomm thermal mitigation (TMD) cooling devices > + > +maintainers: > + - Bhupesh Sharma <bhupesh.sharma@xxxxxxxxxx> > + > +description: > + Qualcomm thermal mitigation (TMD) cooling devices. Each child node > + represents one remote subsystem and each child of this subsystem in-turn > + represents separate cooling devices. > + > +properties: > + $nodename: > + pattern: "^(modem|adsp|cdsp|slpi[0-9])?$" > + > + qcom,instance-id: > + $ref: /schemas/types.yaml#/definitions/uint32 > + description: > + Remote subsystem QMI server instance id to be used for communicating with QMI. > + > +patternProperties: > + "^tmd-device[0-9]?$": So max 10 cooling devices per remote? > + type: object > + description: > + Subnodes indicating tmd cooling device of a specific category. > + properties: > + label: > + maxItems: 1 > + description: | > + Remote subsystem device identifier. Acceptable device names - > + "pa" -> for pa cooling device, > + "cpuv_restriction_cold" -> for vdd restriction, > + "cx_vdd_limit" -> for vdd limit, > + "modem" -> for processor passive cooling device, > + "modem_current" -> for current limiting device, > + "modem_bw" -> for bus bandwidth limiting device, > + "cpr_cold" -> for cpr restriction. Afaict there are about 50 valid cooling devices listed in the driver. Why limit this to these 7 here? > + > + "#cooling-cells": > + const: 2 > + > + required: > + - label > + - "#cooling-cells" > + > + additionalProperties: false > + > +required: > + - qcom,instance-id > + > +additionalProperties: false > + > +examples: > + - | > + #include <dt-bindings/thermal/qcom,tmd.h> > + modem0 { As written here this example is incomplete, as these nodes can't live on their own. But this is actually what I propose above. > + qcom,instance-id = <MODEM0_INSTANCE_ID>; > + > + modem0_pa: tmd-device0 { > + label = "pa"; > + #cooling-cells = <2>; > + }; > + > + modem0_proc: tmd-device1 { > + label = "modem"; > + #cooling-cells = <2>; > + }; > + > + modem0_current: tmd-device2 { > + label = "modem_current"; > + #cooling-cells = <2>; > + }; > + > + modem0_skin: tmd-device3 { > + label = "modem_skin"; > + #cooling-cells = <2>; > + }; > + > + modem0_vdd: tmd-device4 { > + label = "cpuv_restriction_cold"; > + #cooling-cells = <2>; > + }; > + }; > + > + - | > + #include <dt-bindings/thermal/qcom,tmd.h> > + adsp { > + qcom,instance-id = <ADSP_INSTANCE_ID>; > + > + adsp_vdd: tmd-device1 { > + label = "cpuv_restriction_cold"; > + #cooling-cells = <2>; > + }; > + }; > + > + - | > + #include <dt-bindings/thermal/qcom,tmd.h> > + cdsp { > + qcom,instance-id = <CDSP_INSTANCE_ID>; > + > + cdsp_vdd: tmd-device1 { > + label = "cpuv_restriction_cold"; > + #cooling-cells = <2>; > + }; > + }; > + > + - | > + #include <dt-bindings/thermal/qcom,tmd.h> > + slpi { > + qcom,instance-id = <SLPI_INSTANCE_ID>; > + > + slpi_vdd: tmd-device1 { > + label = "cpuv_restriction_cold"; > + #cooling-cells = <2>; > + }; > + }; > diff --git a/include/dt-bindings/thermal/qcom,tmd.h b/include/dt-bindings/thermal/qcom,tmd.h > new file mode 100644 > index 000000000000..5ede4422e04e > --- /dev/null > +++ b/include/dt-bindings/thermal/qcom,tmd.h This is a quite generic name, how about qcom,qmi-cooling.h? > @@ -0,0 +1,14 @@ > +/* SPDX-License-Identifier: GPL-2.0 */ > +/* > + * This header provides constants for the Qualcomm TMD instances. > + */ > + > +#ifndef _DT_BINDINGS_THERMAL_QCOM_TMD_H_ > +#define _DT_BINDINGS_THERMAL_QCOM_TMD_H_ > + > +#define MODEM0_INSTANCE_ID 0x0 > +#define ADSP_INSTANCE_ID 0x1 > +#define CDSP_INSTANCE_ID 0x43 > +#define SLPI_INSTANCE_ID 0x53 QMI cooling isn't the only thing dealing with "instance id" and all of them would deal with instances ids of type modem, adsp, cdsp, slpi etc. As such I think these are too generic, how about QMI_COOLING_ADSP etc? Regards, Bjorn > + > +#endif > -- > 2.37.1 >
