[PATCH v4 0/3] usb: chipidea: msm: Clean and fix glue layer driver

[Date Prev][Date Next][Thread Prev][Thread Next][Date Index][Thread Index]

 



From: "Ivan T. Ivanov" <iivanov@xxxxxxxxxx>

This series intend to fix driver, which was broken for a while.
It is used to create peripheral role device, which in coordination
with phy-usb-msm driver could provide USB2.0 gadget support for
Qualcomm targets.

Changes since version 3.

 - Fix typo in devicetree description file.

Previews version can be found here:

https://lkml.org/lkml/2014/4/22/195

Ivan T. Ivanov (3):
  usb: chipidea: msm: Add device tree binding information
  usb: chipidea: msm: Add device tree support
  usb: chipidea: msm: Initialize offset of the capability registers

 .../devicetree/bindings/usb/ci-hdrc-qcom.txt       | 17 +++++++++++++++
 drivers/usb/chipidea/ci_hdrc_msm.c                 | 24 +++++++++++++++++++++-
 2 files changed, 40 insertions(+), 1 deletion(-)
 create mode 100644 Documentation/devicetree/bindings/usb/ci-hdrc-qcom.txt

--
1.8.3.2

--
To unsubscribe from this list: send the line "unsubscribe linux-arm-msm" in
the body of a message to majordomo@xxxxxxxxxxxxxxx
More majordomo info at  http://vger.kernel.org/majordomo-info.html




[Index of Archives]     [Linux ARM Kernel]     [Linux ARM]     [Linux Omap]     [Fedora ARM]     [Linux for Sparc]     [IETF Annouce]     [Security]     [Bugtraq]     [Linux MIPS]     [ECOS]     [Asterisk Internet PBX]     [Linux API]

  Powered by Linux