On 07/03/2025 15:17, Jason Gunthorpe wrote:
On Fri, Mar 07, 2025 at 01:19:11PM +1100, Alexey Kardashevskiy wrote:
Part of my problem here is I don't see anyone who seems to have read
all three specs and is trying to mush them together. Everyone is
focused on their own spec. I know there are subtle differences :\
One is SEV TIO (earlier version published), another one TDX Connect (which I
do not have and asked above) and what is the third one here? Or is it 4 as
ARM and RiscV both doing this now? Thanks,
ARM will come with a spec someday, I don't know about RISCV. Maybe it
is 4..
The Arm CCA DA (Device Assignment, as we call it) specs are available in
Alpha stage here, under "Future version" section.
https://developer.arm.com/documentation/den0137/latest/
Cheers
Suzuki
Jason
