Hi, On Wednesday, April 18, 2018 07:10:30 AM Eduardo Valentin wrote: > Hello, > > On Wed, Apr 18, 2018 at 03:51:29PM +0800, Zhang Rui wrote: > > Hi, Eduardo, > > > > On å?, 2018-04-14 at 11:30 -0700, Eduardo Valentin wrote: > > > Hello Linus, > > > > > > Please find thermal-soc changes for v4.17-rc1. > > > Rui asked me to send the pull request directly to you > > > as we are close to the end of the merge window. > > > Essentially this pull removes the series that caused > > > warning regression. I will work with the developer > > > to get that fixed later on, but I am still sending > > > the other few patches that are unrelated to that. > > > Let me know if this causes any issues and can still > > > be pulled. > > > > > > Changelog: > > > - New i.MX7 thermal sensor > > > - Mediatek driver now supports MT7622 SoC > > > - Removal of min max cpu cooling DT property > > > > > > Differences in V3: > > > - Rebased on top current linus/master, to avoid and merge issues > > > from previous pulled thermal code. > > > > > > Differences in V2: > > > - Reordered the patches to drop exynos changes for now until we get > > > agreement on the fix on that driver for the compilation warns > > > caused by the confusing conversion functions. > > > > > > > > > The following changes since commit > > > 48023102b7078a6674516b1fe0d639669336049d: > > > > > >  Merge branch 'overlayfs-linus' of > > > git://git.kernel.org/pub/scm/linux/kernel/git/mszeredi/vfs (2018-04- > > > 13 16:55:41 -0700) > > > > > > are available in the git repository at: > > > > > >  git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc- > > > thermal linus > > > > > > for you to fetch changes up to > > > 15a32df1918259be6c23fc36014fc26ee66c836c: > > > > > >  dt-bindings: thermal: Remove "cooling-{min|max}-level" properties > > > (2018-04-14 09:37:55 -0700) > > > > > This pull request does not catch this merge window. > > So do you want to split it into 2 separate pull requests, one for 4.17- > > rc and another for 4.18-rc1? > > OK. Yeah, I am fine with that. > > > > > > ---------------------------------------------------------------- > > > Anson Huang (1): > > >       thermal: imx: add i.MX7 thermal sensor support > > > > > > Bartlomiej Zolnierkiewicz (1): > > >       dt-bindings: thermal: remove no longer needed samsung thermal > > > properties > > > > > > Sean Wang (2): > > >       dt-bindings: thermal: add binding for MT7622 SoC > > >       thermal: mediatek: add support for MT7622 SoC > > > > > > Viresh Kumar (1): > > >       dt-bindings: thermal: Remove "cooling-{min|max}-level" > > > properties > > > > > IMO, together with the refreshed exynos fixes, the one from Viresh and > > the one from Bartlomiej can be queued for 4.17-rc, and the others have > > to wait until next merge window. > > > > Correct, the new chip support will need to wait for the next merge > window. I have already split the patches into the two categories. > The patches removing stuff are in my -fixes branch. All the other adding > new chip support are in my -linus branch. > > Now, Do you have anything for this -rc2 ? If not, I will send directly > to Linus the stuff in my -fixes branch. Let me know. What about refreshed Exynos patches (https://lkml.org/lkml/2018/4/16/256)? Fixes from Marek (first two patches) are quite critical (without them booting with thermal enabled triggers critical temperature handling on Exynos4210 SoC). Best regards, -- Bartlomiej Zolnierkiewicz Samsung R&D Institute Poland Samsung Electronics -- To unsubscribe from this list: send the line "unsubscribe linux-acpi" in the body of a message to majordomo@xxxxxxxxxxxxxxx More majordomo info at http://vger.kernel.org/majordomo-info.html