On 二, 2012-08-21 at 03:28 -0600, R, Durgadoss wrote: > Hi Rui, > > > > > On 二, 2012-08-21 at 00:41 -0600, R, Durgadoss wrote: > > > Hi Rui, > > > > > > > > > -----Original Message----- > > > > > > From: linux-acpi-owner@xxxxxxxxxxxxxxx [mailto:linux-acpi- > > > > > > owner@xxxxxxxxxxxxxxx] On Behalf Of Eduardo Valentin > > > > > > Sent: Tuesday, August 21, 2012 11:10 AM > > > > > > To: R, Durgadoss > > > > > > Cc: lenb@xxxxxxxxxx; Zhang, Rui; rjw@xxxxxxx; linux- > > acpi@xxxxxxxxxxxxxxx; > > > > > > linux-pm@xxxxxxxxxxxxxxx; eduardo.valentin@xxxxxx; > > > > > > amit.kachhap@xxxxxxxxxx; wni@xxxxxxxxxx > > > > > > Subject: Re: [PATCH 13/13] Thermal: Platform layer changes to > > provide > > > > > > thermal data > > > > > > > > > > > > Hello, > > > > > > > > > > > > On Thu, Aug 09, 2012 at 06:16:05PM +0530, Durgadoss R wrote: > > > > > > > This patch shows how can we add platform specific thermal data > > > > > > > required by the thermal framework. This is just an example > > > > > > > patch, and _not_ for merge. > > > > > > > > > > > > > > Signed-off-by: Durgadoss R <durgadoss.r@xxxxxxxxx> > > > > > > > --- > > > > > > > arch/x86/platform/mrst/mrst.c | 42 > > > > > > +++++++++++++++++++++++++++++++++++++++++ > > > > > > > 1 file changed, 42 insertions(+) > > > > > > > > > > > > > > diff --git a/arch/x86/platform/mrst/mrst.c > > > > > > b/arch/x86/platform/mrst/mrst.c > > > > > > > index fd41a92..0440db5 100644 > > > > > > > --- a/arch/x86/platform/mrst/mrst.c > > > > > > > +++ b/arch/x86/platform/mrst/mrst.c > > > > > > > @@ -30,6 +30,7 @@ > > > > > > > #include <linux/mfd/intel_msic.h> > > > > > > > #include <linux/gpio.h> > > > > > > > #include <linux/i2c/tc35876x.h> > > > > > > > +#include <linux/thermal.h> > > > > > > > > > > > > > > #include <asm/setup.h> > > > > > > > #include <asm/mpspec_def.h> > > > > > > > @@ -78,6 +79,30 @@ struct sfi_rtc_table_entry > > > > > > sfi_mrtc_array[SFI_MRTC_MAX]; > > > > > > > EXPORT_SYMBOL_GPL(sfi_mrtc_array); > > > > > > > int sfi_mrtc_num; > > > > > > > > > > > > > > +#define MRST_THERMAL_ZONES 3 > > > > > > > +struct thermal_zone_params tzp[MRST_THERMAL_ZONES] = { > > > > > > > + { .thermal_zone_name = "CPU", > > > > > > > + .throttle_policy = THERMAL_FAIR_SHARE, > > > > > > > + .num_cdevs = 2, > > > > > > > + .cdevs_name = {"CPU", "Battery"}, > > > > > > > + .trip_mask = {0x0F, 0x08}, > > > > > > > + .weights = {80, 20}, }, > > > > > > > + > > > > > > > + { .thermal_zone_name = "Battery", > > > > > > > + .throttle_policy = THERMAL_FAIR_SHARE, > > > > > > > + .num_cdevs = 1, > > > > > > > + .cdevs_name = {"Battery"}, > > > > > > > + .trip_mask = {0x0F}, > > > > > > > + .weights = {100}, }, > > > > > > > + > > > > > > > + { .thermal_zone_name = "Skin", > > > > > > > + .throttle_policy = THERMAL_FAIR_SHARE, > > > > > > > + .num_cdevs = 2, > > > > > > > + .cdevs_name = {"Display", "Battery"}, > > > > > > > + .trip_mask = {0x0F, 0x0F}, > > > > > > > + .weights = {50, 50}, } > > > > > > > > > > > > Please consider the comment I sent on your data definition and also > > the > > > > > > comment I made on this patch on your RFC series. > > > > > > > > > > Yes.. I don't know why/how I missed it. > > > > > Also, saw the same comment on one of the other patches also. > > > > > > > > > > Will surely fix this thing in v2. > > > > > > > > > > BTW, any suggestion for the 'name' of that structure ? :-) > > > > > > > > hmmm, > > > > do we still have thermal_zone_platforms in patch v2? > > > > I do not think we need this if we only bind devices via .bind() > > > > callback. > > > > > > We can bind devices via .bind call back, and that will take some load > > > off the framework code. But even then, we would need this structure > > > right ? > > why? > > I'd prefer introduce something like this, > > struct thermal_bind_params { > > int trip; > > unsigned long upper; > > unsinged long lower; > > int weight; > > int sample_period; > > } > > Yes, this can work with little bit change like below: > > struct thermal_zone_params { > const char *zone_name; > int num_cdevs; > struct thermal_bind_params[num_cdevs]; no, not num_cdevs. Say CPU is used for both passive trip point 1 and passive trip point 2, it has different lower/upper limit and weight. and we need two thermal_bind_params here. > }; > > Where struct thermal_bind_params will be like this: > { > .cdev_name = "CPU" and the cooling device name must be unique in this case, which I do not think it is reasonable. because cooling devices are registered from different drivers, we do not have a rule that followed by all these drivers. > .trip_mask = 0x0F > .weight = 70 > .lower = 2 > .upper = 4 > .sample_period = 1000 (1 ms) > }; > if we want a way to register a couple of binding information to thermal framework together with the thermal zone, I'd prefer something like this, struct thermal_zone_params { struct thermal_zone_device *tz; int count; struct thermal_bind_params *bindings; } struct thermal_bind_params { .id = 1; .match = platform_match_callback(); .cdev = NULL; .weight = 70 ... } and in thermal_zone_device_register, we can have the code like this: list_for_each_entry(cdev, &thermal_cdev_list, node) { for (i = 0; i < tz->params->count, i++) { if (tz->params->bindings[i].cdev) continue; /* check if this is the binding for this device */ if (tz->params->bindings[i].match(tz, cdev, i)) continue; tz->params->bindings[i]->cdev = cdev; thermal_zone_bind_cooling_device(tz, cdev, &tz->params->binding[i]); } } and we can have similar code in thermal_cdev_register(). you can do whatever in your platform_match_callback(), either strcmp or checking devdata, or anything else. thanks, rui -- To unsubscribe from this list: send the line "unsubscribe linux-acpi" in the body of a message to majordomo@xxxxxxxxxxxxxxx More majordomo info at http://vger.kernel.org/majordomo-info.html
