The document currently uses large indentations which make the text too wide for easy readability. Also improve general consistency. Signed-off-by: Frans Pop <elendil@xxxxxxxxx> Cc: Zhang Rui <rui.zhang@xxxxxxxxx> Cc: Sujith Thomas <sujith.thomas@xxxxxxxxx> Cc: Matthew Garrett <mjg59@xxxxxxxxxxxxx> --- Documentation/thermal/sysfs-api.txt | 380 ++++++++++++++++++----------------- 1 files changed, 192 insertions(+), 188 deletions(-) diff --git a/Documentation/thermal/sysfs-api.txt b/Documentation/thermal/sysfs-api.txt index 70d68ce..895337f 100644 --- a/Documentation/thermal/sysfs-api.txt +++ b/Documentation/thermal/sysfs-api.txt @@ -1,5 +1,5 @@ Generic Thermal Sysfs driver How To -========================= +=================================== Written by Sujith Thomas <sujith.thomas@xxxxxxxxx>, Zhang Rui <rui.zhang@xxxxxxxxx> @@ -10,20 +10,20 @@ Copyright (c) 2008 Intel Corporation 0. Introduction -The generic thermal sysfs provides a set of interfaces for thermal zone devices (sensors) -and thermal cooling devices (fan, processor...) to register with the thermal management -solution and to be a part of it. +The generic thermal sysfs provides a set of interfaces for thermal zone +devices (sensors) and thermal cooling devices (fan, processor...) to register +with the thermal management solution and to be a part of it. -This how-to focuses on enabling new thermal zone and cooling devices to participate -in thermal management. -This solution is platform independent and any type of thermal zone devices and -cooling devices should be able to make use of the infrastructure. +This how-to focuses on enabling new thermal zone and cooling devices to +participate in thermal management. +This solution is platform independent and any type of thermal zone devices +and cooling devices should be able to make use of the infrastructure. -The main task of the thermal sysfs driver is to expose thermal zone attributes as well -as cooling device attributes to the user space. -An intelligent thermal management application can make decisions based on inputs -from thermal zone attributes (the current temperature and trip point temperature) -and throttle appropriate devices. +The main task of the thermal sysfs driver is to expose thermal zone attributes +as well as cooling device attributes to the user space. +An intelligent thermal management application can make decisions based on +inputs from thermal zone attributes (the current temperature and trip point +temperature) and throttle appropriate devices. [0-*] denotes any positive number starting from 0 [1-*] denotes any positive number starting from 1 @@ -31,77 +31,77 @@ and throttle appropriate devices. 1. thermal sysfs driver interface functions 1.1 thermal zone device interface -1.1.1 struct thermal_zone_device *thermal_zone_device_register(char *name, int trips, - void *devdata, struct thermal_zone_device_ops *ops) - - This interface function adds a new thermal zone device (sensor) to - /sys/class/thermal folder as thermal_zone[0-*]. - It tries to bind all the thermal cooling devices registered at the same time. - - name: the thermal zone name. - trips: the total number of trip points this thermal zone supports. - devdata: device private data - ops: thermal zone device call-backs. - .bind: bind the thermal zone device with a thermal cooling device. - .unbind: unbind the thermal zone device with a thermal cooling device. - .get_temp: get the current temperature of the thermal zone. - .get_mode: get the current mode (user/kernel) of the thermal zone. - "kernel" means thermal management is done in kernel. - "user" will prevent kernel thermal driver actions upon trip points - so that user applications can take charge of thermal management. - .set_mode: set the mode (user/kernel) of the thermal zone. - .get_trip_type: get the type of certain trip point. - .get_trip_temp: get the temperature above which the certain trip point - will be fired. +1.1.1 struct thermal_zone_device *thermal_zone_device_register(char *name, + int trips, void *devdata, struct thermal_zone_device_ops *ops) + + This interface function adds a new thermal zone device (sensor) to + /sys/class/thermal folder as thermal_zone[0-*]. It tries to bind all the + thermal cooling devices registered at the same time. + + name: the thermal zone name. + trips: the total number of trip points this thermal zone supports. + devdata: device private data + ops: thermal zone device call-backs. + .bind: bind the thermal zone device with a thermal cooling device. + .unbind: unbind the thermal zone device with a thermal cooling device. + .get_temp: get the current temperature of the thermal zone. + .get_mode: get the current mode (user/kernel) of the thermal zone. + - "kernel" means thermal management is done in kernel. + - "user" will prevent kernel thermal driver actions upon trip points + so that user applications can take charge of thermal management. + .set_mode: set the mode (user/kernel) of the thermal zone. + .get_trip_type: get the type of certain trip point. + .get_trip_temp: get the temperature above which the certain trip point + will be fired. 1.1.2 void thermal_zone_device_unregister(struct thermal_zone_device *tz) - This interface function removes the thermal zone device. - It deletes the corresponding entry form /sys/class/thermal folder and unbind all - the thermal cooling devices it uses. + This interface function removes the thermal zone device. + It deletes the corresponding entry form /sys/class/thermal folder and + unbind all the thermal cooling devices it uses. 1.2 thermal cooling device interface 1.2.1 struct thermal_cooling_device *thermal_cooling_device_register(char *name, - void *devdata, struct thermal_cooling_device_ops *) - - This interface function adds a new thermal cooling device (fan/processor/...) to - /sys/class/thermal/ folder as cooling_device[0-*]. - It tries to bind itself to all the thermal zone devices register at the same time. - name: the cooling device name. - devdata: device private data. - ops: thermal cooling devices call-backs. - .get_max_state: get the Maximum throttle state of the cooling device. - .get_cur_state: get the Current throttle state of the cooling device. - .set_cur_state: set the Current throttle state of the cooling device. + void *devdata, struct thermal_cooling_device_ops *) + + This interface function adds a new thermal cooling device (fan/processor/...) + to /sys/class/thermal/ folder as cooling_device[0-*]. It tries to bind itself + to all the thermal zone devices register at the same time. + name: the cooling device name. + devdata: device private data. + ops: thermal cooling devices call-backs. + .get_max_state: get the Maximum throttle state of the cooling device. + .get_cur_state: get the Current throttle state of the cooling device. + .set_cur_state: set the Current throttle state of the cooling device. 1.2.2 void thermal_cooling_device_unregister(struct thermal_cooling_device *cdev) - This interface function remove the thermal cooling device. - It deletes the corresponding entry form /sys/class/thermal folder and unbind - itself from all the thermal zone devices using it. + This interface function remove the thermal cooling device. + It deletes the corresponding entry form /sys/class/thermal folder and + unbind itself from all the thermal zone devices using it. 1.3 interface for binding a thermal zone device with a thermal cooling device 1.3.1 int thermal_zone_bind_cooling_device(struct thermal_zone_device *tz, - int trip, struct thermal_cooling_device *cdev); + int trip, struct thermal_cooling_device *cdev); - This interface function bind a thermal cooling device to the certain trip point - of a thermal zone device. - This function is usually called in the thermal zone device .bind callback. - tz: the thermal zone device - cdev: thermal cooling device - trip: indicates which trip point the cooling devices is associated with - in this thermal zone. + This interface function bind a thermal cooling device to the certain trip + point of a thermal zone device. + This function is usually called in the thermal zone device .bind callback. + tz: the thermal zone device + cdev: thermal cooling device + trip: indicates which trip point the cooling devices is associated with + in this thermal zone. 1.3.2 int thermal_zone_unbind_cooling_device(struct thermal_zone_device *tz, - int trip, struct thermal_cooling_device *cdev); + int trip, struct thermal_cooling_device *cdev); - This interface function unbind a thermal cooling device from the certain trip point - of a thermal zone device. - This function is usually called in the thermal zone device .unbind callback. - tz: the thermal zone device - cdev: thermal cooling device - trip: indicates which trip point the cooling devices is associated with - in this thermal zone. + This interface function unbind a thermal cooling device from the certain + trip point of a thermal zone device. This function is usually called in + the thermal zone device .unbind callback. + tz: the thermal zone device + cdev: thermal cooling device + trip: indicates which trip point the cooling devices is associated with + in this thermal zone. 2. sysfs attributes structure @@ -114,153 +114,157 @@ if hwmon is compiled in or built as a module. Thermal zone device sys I/F, created once it's registered: /sys/class/thermal/thermal_zone[0-*]: - |-----type: Type of the thermal zone - |-----temp: Current temperature - |-----mode: Working mode of the thermal zone - |-----trip_point_[0-*]_temp: Trip point temperature - |-----trip_point_[0-*]_type: Trip point type + |---type: Type of the thermal zone + |---temp: Current temperature + |---mode: Working mode of the thermal zone + |---trip_point_[0-*]_temp: Trip point temperature + |---trip_point_[0-*]_type: Trip point type Thermal cooling device sys I/F, created once it's registered: /sys/class/thermal/cooling_device[0-*]: - |-----type : Type of the cooling device(processor/fan/...) - |-----max_state: Maximum cooling state of the cooling device - |-----cur_state: Current cooling state of the cooling device + |---type: Type of the cooling device(processor/fan/...) + |---max_state: Maximum cooling state of the cooling device + |---cur_state: Current cooling state of the cooling device -These two dynamic attributes are created/removed in pairs. -They represent the relationship between a thermal zone and its associated cooling device. -They are created/removed for each -thermal_zone_bind_cooling_device/thermal_zone_unbind_cooling_device successful execution. +Then next two dynamic attributes are created/removed in pairs. They represent +the relationship between a thermal zone and its associated cooling device. +They are created/removed for each successful execution of +thermal_zone_bind_cooling_device/thermal_zone_unbind_cooling_device. -/sys/class/thermal/thermal_zone[0-*] - |-----cdev[0-*]: The [0-*]th cooling device in the current thermal zone - |-----cdev[0-*]_trip_point: Trip point that cdev[0-*] is associated with +/sys/class/thermal/thermal_zone[0-*]: + |---cdev[0-*]: [0-*]th cooling device in current thermal zone + |---cdev[0-*]_trip_point: Trip point that cdev[0-*] is associated with Besides the thermal zone device sysfs I/F and cooling device sysfs I/F, -the generic thermal driver also creates a hwmon sysfs I/F for each _type_ of -thermal zone device. E.g. the generic thermal driver registers one hwmon class device -and build the associated hwmon sysfs I/F for all the registered ACPI thermal zones. +the generic thermal driver also creates a hwmon sysfs I/F for each _type_ +of thermal zone device. E.g. the generic thermal driver registers one hwmon +class device and build the associated hwmon sysfs I/F for all the registered +ACPI thermal zones. + /sys/class/hwmon/hwmon[0-*]: - |-----name: The type of the thermal zone devices. - |-----temp[1-*]_input: The current temperature of thermal zone [1-*]. - |-----temp[1-*]_critical: The critical trip point of thermal zone [1-*]. + |---name: The type of the thermal zone devices + |---temp[1-*]_input: The current temperature of thermal zone [1-*] + |---temp[1-*]_critical: The critical trip point of thermal zone [1-*] + Please read Documentation/hwmon/sysfs-interface for additional information. *************************** * Thermal zone attributes * *************************** -type Strings which represent the thermal zone type. - This is given by thermal zone driver as part of registration. - Eg: "acpitz" indicates it's an ACPI thermal device. - In order to keep it consistent with hwmon sys attribute, - this should be a short, lowercase string, - not containing spaces nor dashes. - RO - Required - -temp Current temperature as reported by thermal zone (sensor) - Unit: millidegree Celsius - RO - Required - -mode One of the predefined values in [kernel, user] - This file gives information about the algorithm - that is currently managing the thermal zone. - It can be either default kernel based algorithm - or user space application. - RW - Optional - kernel = Thermal management in kernel thermal zone driver. - user = Preventing kernel thermal zone driver actions upon - trip points so that user application can take full - charge of the thermal management. - -trip_point_[0-*]_temp The temperature above which trip point will be fired - Unit: millidegree Celsius - RO - Optional - -trip_point_[0-*]_type Strings which indicate the type of the trip point - E.g. it can be one of critical, hot, passive, - active[0-*] for ACPI thermal zone. - RO - Optional - -cdev[0-*] Sysfs link to the thermal cooling device node where the sys I/F - for cooling device throttling control represents. - RO - Optional - -cdev[0-*]_trip_point The trip point with which cdev[0-*] is associated in this thermal zone - -1 means the cooling device is not associated with any trip point. - RO - Optional - -****************************** -* Cooling device attributes * -****************************** - -type String which represents the type of device - eg: For generic ACPI: this should be "Fan", - "Processor" or "LCD" - eg. For memory controller device on intel_menlow platform: - this should be "Memory controller" - RO - Required - -max_state The maximum permissible cooling state of this cooling device. - RO - Required - -cur_state The current cooling state of this cooling device. - the value can any integer numbers between 0 and max_state, - cur_state == 0 means no cooling - cur_state == max_state means the maximum cooling. - RW - Required +type + Strings which represent the thermal zone type. + This is given by thermal zone driver as part of registration. + E.g: "acpitz" indicates it's an ACPI thermal device. + In order to keep it consistent with hwmon sys attribute; this should + be a short, lowercase string, not containing spaces nor dashes. + RO, Required + +temp + Current temperature as reported by thermal zone (sensor). + Unit: millidegree Celsius + RO, Required + +mode + One of the predefined values in [kernel, user]. + This file gives information about the algorithm that is currently + managing the thermal zone. It can be either default kernel based + algorithm or user space application. + kernel = Thermal management in kernel thermal zone driver. + user = Preventing kernel thermal zone driver actions upon + trip points so that user application can take full + charge of the thermal management. + RW, Optional + +trip_point_[0-*]_temp + The temperature above which trip point will be fired. + Unit: millidegree Celsius + RO, Optional + +trip_point_[0-*]_type + Strings which indicate the type of the trip point. + E.g. it can be one of critical, hot, passive, active[0-*] for ACPI + thermal zone. + RO, Optional + +cdev[0-*] + Sysfs link to the thermal cooling device node where the sys I/F + for cooling device throttling control represents. + RO, Optional + +cdev[0-*]_trip_point + The trip point with which cdev[0-*] is associated in this thermal + zone; -1 means the cooling device is not associated with any trip + point. + RO, Optional + +***************************** +* Cooling device attributes * +***************************** + +type + String which represents the type of device, e.g: + - for generic ACPI: should be "Fan", "Processor" or "LCD" + - for memory controller device on intel_menlow platform: + should be "Memory controller". + RO, Required + +max_state + The maximum permissible cooling state of this cooling device. + RO, Required + +cur_state + The current cooling state of this cooling device. + The value can any integer numbers between 0 and max_state: + - cur_state == 0 means no cooling + - cur_state == max_state means the maximum cooling. + RW, Required 3. A simple implementation -ACPI thermal zone may support multiple trip points like critical/hot/passive/active. -If an ACPI thermal zone supports critical, passive, active[0] and active[1] at the same time, -it may register itself as a thermal_zone_device (thermal_zone1) with 4 trip points in all. -It has one processor and one fan, which are both registered as thermal_cooling_device. -If the processor is listed in _PSL method, and the fan is listed in _AL0 method, -the sys I/F structure will be built like this: +ACPI thermal zone may support multiple trip points like critical, hot, +passive, active. If an ACPI thermal zone supports critical, passive, +active[0] and active[1] at the same time, it may register itself as a +thermal_zone_device (thermal_zone1) with 4 trip points in all. +It has one processor and one fan, which are both registered as +thermal_cooling_device. + +If the processor is listed in _PSL method, and the fan is listed in _AL0 +method, the sys I/F structure will be built like this: /sys/class/thermal: |thermal_zone1: - |-----type: acpitz - |-----temp: 37000 - |-----mode: kernel - |-----trip_point_0_temp: 100000 - |-----trip_point_0_type: critical - |-----trip_point_1_temp: 80000 - |-----trip_point_1_type: passive - |-----trip_point_2_temp: 70000 - |-----trip_point_2_type: active0 - |-----trip_point_3_temp: 60000 - |-----trip_point_3_type: active1 - |-----cdev0: --->/sys/class/thermal/cooling_device0 - |-----cdev0_trip_point: 1 /* cdev0 can be used for passive */ - |-----cdev1: --->/sys/class/thermal/cooling_device3 - |-----cdev1_trip_point: 2 /* cdev1 can be used for active[0]*/ + |---type: acpitz + |---temp: 37000 + |---mode: kernel + |---trip_point_0_temp: 100000 + |---trip_point_0_type: critical + |---trip_point_1_temp: 80000 + |---trip_point_1_type: passive + |---trip_point_2_temp: 70000 + |---trip_point_2_type: active0 + |---trip_point_3_temp: 60000 + |---trip_point_3_type: active1 + |---cdev0: --->/sys/class/thermal/cooling_device0 + |---cdev0_trip_point: 1 /* cdev0 can be used for passive */ + |---cdev1: --->/sys/class/thermal/cooling_device3 + |---cdev1_trip_point: 2 /* cdev1 can be used for active[0]*/ |cooling_device0: - |-----type: Processor - |-----max_state: 8 - |-----cur_state: 0 + |---type: Processor + |---max_state: 8 + |---cur_state: 0 |cooling_device3: - |-----type: Fan - |-----max_state: 2 - |-----cur_state: 0 + |---type: Fan + |---max_state: 2 + |---cur_state: 0 /sys/class/hwmon: |hwmon0: - |-----name: acpitz - |-----temp1_input: 37000 - |-----temp1_crit: 100000 + |---name: acpitz + |---temp1_input: 37000 + |---temp1_crit: 100000 -- 1.5.6.5 -- To unsubscribe from this list: send the line "unsubscribe linux-acpi" in the body of a message to majordomo@xxxxxxxxxxxxxxx More majordomo info at http://vger.kernel.org/majordomo-info.html
