On Saturday, January 21, 2023 12:15:28 AM CET Daniel Lezcano wrote: > The ACPI specification describes the trip points, the device tree > bindings as well. > > The OF code uses the generic trip point structures. > > The ACPI has their own trip points structure and uses the get_trip_* > ops to retrieve them. > > We can do the same as the OF code and create a set of ACPI functions > to retrieve a trip point description. Having a common code for ACPI > will help to cleanup the remaining Intel drivers and get rid of the > get_trip_* functions. > > These changes add the ACPI thermal calls to retrieve the basic > information we need to be reused in the thermal ACPI and Intel > drivers. > > The different ACPI functions have the generic trip point structure > passed as parameter where it is filled. > > This structure aims to be the one used by all the thermal drivers and > the thermal framework. > > After this series, a couple of Intel drivers and the ACPI thermal > driver will still have their own trip points definition but a new > series on top of this one will finish the conversion to the generic > trip point handling. > > This series depends on the generic trip point added to the thermal > framework and available in the thermal/linux-next branch. > > https://lkml.org/lkml/2022/10/3/456 > > It has been tested on a Intel i7-8650U - x280 with the INT3400, the > PCH, ACPITZ, and x86_pkg_temp. No regression observed so far. > > Signed-off-by: Daniel Lezcano <daniel.lezcano@xxxxxxxxxx> > Reviewed-by: Zhang Rui <rui.zhang@xxxxxxxxx> > Tested-by: srinivas pandruvada <srinivas.pandruvada@xxxxxxxxxxxxxxx> Co-developed-by: Rafael J. Wysocki <rafael.j.wysocki@xxxxxxxxx> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@xxxxxxxxx> Also I'm not sure if this version has been tested and reviewed. There are still a few things to improve in it, but overall I think that something like the patch below would be better - it is fewer lines of code and less duplication. I haven't compiled it, but it should be easy enough to fix if it fails to build. I am also not sure about the included header files (kernel.h and uapi/linux/thermal.h in particular). --- From: Rafael J. Wysocki <rafael.j.wysocki@xxxxxxxxx> Subject: [PATCH] thermal: ACPI: Add ACPI trip point routines Add library routines to populate a generic thermal trip point structure with data obtained by evaluating a specific object in the ACPI Namespace. Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@xxxxxxxxx> Co-developed-by: Daniel Lezcano <daniel.lezcano@xxxxxxxxxx> Signed-off-by: Daniel Lezcano <daniel.lezcano@xxxxxxxxxx> --- drivers/thermal/Kconfig | 4 + drivers/thermal/Makefile | 1 drivers/thermal/thermal_acpi.c | 153 +++++++++++++++++++++++++++++++++++++++++ include/linux/thermal.h | 8 ++ 4 files changed, 166 insertions(+) create mode 100644 drivers/thermal/thermal_acpi.c Index: linux-pm/drivers/thermal/Kconfig =================================================================== --- linux-pm.orig/drivers/thermal/Kconfig +++ linux-pm/drivers/thermal/Kconfig @@ -76,6 +76,10 @@ config THERMAL_OF Say 'Y' here if you need to build thermal infrastructure based on device tree. +config THERMAL_ACPI + depends on ACPI + bool + config THERMAL_WRITABLE_TRIPS bool "Enable writable trip points" help Index: linux-pm/drivers/thermal/Makefile =================================================================== --- linux-pm.orig/drivers/thermal/Makefile +++ linux-pm/drivers/thermal/Makefile @@ -13,6 +13,7 @@ thermal_sys-$(CONFIG_THERMAL_NETLINK) + # interface to/from other layers providing sensors thermal_sys-$(CONFIG_THERMAL_HWMON) += thermal_hwmon.o thermal_sys-$(CONFIG_THERMAL_OF) += thermal_of.o +thermal_sys-$(CONFIG_THERMAL_ACPI) += thermal_acpi.o # governors thermal_sys-$(CONFIG_THERMAL_GOV_FAIR_SHARE) += gov_fair_share.o Index: linux-pm/drivers/thermal/thermal_acpi.c =================================================================== --- /dev/null +++ linux-pm/drivers/thermal/thermal_acpi.c @@ -0,0 +1,153 @@ +// SPDX-License-Identifier: GPL-2.0 +/* + * Copyright 2023 Linaro Limited + * Copyright 2023 Intel Corporation + * + * Library routines for populating a generic thermal trip point structure + * with data obtained by evaluating a specific object in the ACPI Namespace. + */ +#include <linux/acpi.h> +#include <linux/module.h> +#include <linux/kernel.h> +#include <linux/units.h> +#include <uapi/linux/thermal.h> + +#include "thermal_core.h" + +/* + * Minimum temperature for full military grade is 218°K (-55°C) and + * max temperature is 448°K (175°C). We can consider those values as + * the boundaries for the [trips] temperature returned by the + * firmware. Any values out of these boundaries may be considered + * bogus and we can assume the firmware has no data to provide. + */ +#define TEMP_MIN_DECIK 2180 +#define TEMP_MAX_DECIK 4480 + +static int thermal_acpi_trip_init(struct acpi_device *adev, + enum thermal_trip_type type, int id, + struct thermal_trip *trip) +{ + unsigned long long temp; + acpi_status status; + char obj_name[5]; + + switch (type) { + case THERMAL_TRIP_ACTIVE: + if (id < 0 || id > 9) + return -EINVAL; + + obj_name[1] = 'A'; + obj_name[2] = 'C'; + obj_name[3] = '0' + id; + break; + case THERMAL_TRIP_PASSIVE: + obj_name[1] = 'P'; + obj_name[2] = 'S'; + obj_name[3] = 'V'; + break; + case THERMAL_TRIP_HOT: + obj_name[1] = 'H'; + obj_name[2] = 'O'; + obj_name[3] = 'T'; + break; + case THERMAL_TRIP_CRITICAL: + obj_name[1] = 'C'; + obj_name[2] = 'R'; + obj_name[3] = 'T'; + break; + } + + obj_name[0] = '_'; + obj_name[4] = '\0'; + + status = acpi_evaluate_integer(adev->handle, obj_name, NULL, &temp); + if (ACPI_FAILURE(status)) { + acpi_handle_debug(adev->handle, "%s evaluation failed\n", obj_name); + return -ENODATA; + } + + if (temp < TEMP_MIN_DECIK || temp >= TEMP_MAX_DECIK) { + acpi_handle_debug(adev->handle, "%s result %llu out of range\n", + temp, obj_name); + return -ENODATA; + } + + trip->temperature = deci_kelvin_to_millicelsius(temp); + trip->hysteresis = 0; + trip->type = type; + + return 0; +} + +/** + * thermal_acpi_trip_active - Get the specified active trip point + * @adev: Thermal zone ACPI device object to get the description from. + * @id: Active cooling level (0 - 9). + * @trip: Trip point structure to be populated on success. + * + * Evaluate the _ACx object for the thermal zone represented by @adev to obtain + * the temperature of the active cooling trip point corresponding to the active + * cooling level given by @id and initialize @trip as an active trip point using + * that temperature value. + * + * Return 0 on success or a negative error value on failure. + */ +int thermal_acpi_trip_active(struct acpi_device *adev, int id, + struct thermal_trip *trip) +{ + return thermal_acpi_trip_init(adev, THERMAL_TRIP_ACTIVE, id, trip); +} +EXPORT_SYMBOL_GPL(thermal_acpi_trip_active); + +/** + * thermal_acpi_trip_passive - Get the passive trip point + * @adev: Thermal zone ACPI device object to get the description from. + * @trip: Trip point structure to be populated on success. + * + * Evaluate the _PSV object for the thermal zone represented by @adev to obtain + * the temperature of the passive cooling trip point and initialize @trip as a + * passive trip point using that temperature value. + * + * Return 0 on success or -ENODATA on failure. + */ +int thermal_acpi_trip_passive(struct acpi_device *adev, struct thermal_trip *trip) +{ + return thermal_acpi_trip_init(adev, THERMAL_TRIP_PASSIVE, INT_MAX, trip); +} +EXPORT_SYMBOL_GPL(thermal_acpi_trip_passive); + +/** + * thermal_acpi_trip_hot - Get the near critical trip point + * @adev: the ACPI device to get the description from. + * @trip: a &struct thermal_trip to be filled if the function succeed. + * + * Evaluate the _HOT object for the thermal zone represented by @adev to obtain + * the temperature of the trip point at which the system is expected to be put + * into the S4 sleep state and initialize @trip as a hot trip point using that + * temperature value. + * + * Return 0 on success or -ENODATA on failure. + */ +int thermal_acpi_trip_hot(struct acpi_device *adev, struct thermal_trip *trip) +{ + return thermal_acpi_trip_init(adev, THERMAL_TRIP_HOT, INT_MAX, trip); +} +EXPORT_SYMBOL_GPL(thermal_acpi_trip_hot); + +/** + * thermal_acpi_trip_critical - Get the critical trip point + * @adev: the ACPI device to get the description from. + * @trip: a &struct thermal_trip to be filled if the function succeed. + * + * Evaluate the _CRT object for the thermal zone represented by @adev to obtain + * the temperature of the critical cooling trip point and initialize @trip as a + * critical trip point using that temperature value. + * + * Return 0 on success or -ENODATA on failure. + */ +int thermal_acpi_trip_critical(struct acpi_device *adev, struct thermal_trip *trip) +{ + return thermal_acpi_trip_init(adev, THERMAL_TRIP_CRITICAL, INT_MAX, trip); +} +EXPORT_SYMBOL_GPL(thermal_acpi_trip_critical); Index: linux-pm/include/linux/thermal.h =================================================================== --- linux-pm.orig/include/linux/thermal.h +++ linux-pm/include/linux/thermal.h @@ -334,6 +334,14 @@ static inline void devm_thermal_of_zone_ } #endif +#ifdef CONFIG_THERMAL_ACPI +int thermal_acpi_trip_active(struct acpi_device *adev, int id, + struct thermal_trip *trip); +int thermal_acpi_trip_passive(struct acpi_device *adev, struct thermal_trip *trip); +int thermal_acpi_trip_hot(struct acpi_device *adev, struct thermal_trip *trip); +int thermal_acpi_trip_critical(struct acpi_device *adev, struct thermal_trip *trip); +#endif + #ifdef CONFIG_THERMAL struct thermal_zone_device *thermal_zone_device_register(const char *, int, int, void *, struct thermal_zone_device_ops *,
