RE: [PATCH v7 13/22] vfio-iommufd: Split bind/attach into two steps

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Subject: RE: [PATCH v7 13/22] vfio-iommufd: Split bind/attach into two steps
From: "Tian, Kevin" <kevin.tian@xxxxxxxxx>
Date: Fri, 17 Mar 2023 01:57:27 +0000
Accept-language: en-US
Cc: "joro@xxxxxxxxxx" <joro@xxxxxxxxxx>, "robin.murphy@xxxxxxx" <robin.murphy@xxxxxxx>, "cohuck@xxxxxxxxxx" <cohuck@xxxxxxxxxx>, "eric.auger@xxxxxxxxxx" <eric.auger@xxxxxxxxxx>, "nicolinc@xxxxxxxxxx" <nicolinc@xxxxxxxxxx>, "kvm@xxxxxxxxxxxxxxx" <kvm@xxxxxxxxxxxxxxx>, "mjrosato@xxxxxxxxxxxxx" <mjrosato@xxxxxxxxxxxxx>, "chao.p.peng@xxxxxxxxxxxxxxx" <chao.p.peng@xxxxxxxxxxxxxxx>, "yi.y.sun@xxxxxxxxxxxxxxx" <yi.y.sun@xxxxxxxxxxxxxxx>, "peterx@xxxxxxxxxx" <peterx@xxxxxxxxxx>, "jasowang@xxxxxxxxxx" <jasowang@xxxxxxxxxx>, "shameerali.kolothum.thodi@xxxxxxxxxx" <shameerali.kolothum.thodi@xxxxxxxxxx>, "lulu@xxxxxxxxxx" <lulu@xxxxxxxxxx>, "suravee.suthikulpanit@xxxxxxx" <suravee.suthikulpanit@xxxxxxx>, "intel-gvt-dev@xxxxxxxxxxxxxxxxxxxxx" <intel-gvt-dev@xxxxxxxxxxxxxxxxxxxxx>, "intel-gfx@xxxxxxxxxxxxxxxxxxxxx" <intel-gfx@xxxxxxxxxxxxxxxxxxxxx>, "linux-s390@xxxxxxxxxxxxxxx" <linux-s390@xxxxxxxxxxxxxxx>, "Hao, Xudong" <xudong.hao@xxxxxxxxx>, "Zhao, Yan Y" <yan.y.zhao@xxxxxxxxx>, "Xu, Terrence" <terrence.xu@xxxxxxxxx>
In-reply-to: <20230316125534.17216-14-yi.l.liu@intel.com>
References: <20230316125534.17216-1-yi.l.liu@intel.com> <20230316125534.17216-14-yi.l.liu@intel.com>

> From: Liu, Yi L <yi.l.liu@xxxxxxxxx>
> Sent: Thursday, March 16, 2023 8:55 PM
> 
> to align with the coming vfio device cdev support.
> 
> Signed-off-by: Yi Liu <yi.l.liu@xxxxxxxxx>

Reviewed-by: Kevin Tian <kevin.tian@xxxxxxxxx>

References:
- [PATCH v7 00/22] Add vfio_device cdev for iommufd support
  - From: Yi Liu
- [PATCH v7 13/22] vfio-iommufd: Split bind/attach into two steps
  - From: Yi Liu

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