ARM: Packed structure

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I am building a boot loader (barebox) with gcc 10.2.0 for a NXP LS1021A for which I intend to use SPD.

The SPD structure for DDR3 (struct ddr3_spd_eeprom )can be found here: https://git.pengutronix.de/cgit/barebox/tree/include/ddr_spd.h

The problem I have is that the field after the union are not packed:

	....
	} registered;
		unsigned char uc[57]; /* 60-116 Module-Specific Section */ ==> uc[56] is at the right place offset 116
	} mod_section;

	/* Unique Module ID: Bytes 117-125 */
	unsigned char mmid_lsb;        /* 117 Module MfgID Code LSB - JEP-106 */ ===> mmid_lsb end up at offset 120 instead of offset 117

I tried the __packed attribute without effect

This is the debug output showing the offset from the start of SPD structure:
uc[56]@ = 0x1000e2cc, 116
mmid_lsb@ = 0x1000e2d0, 120  ==> should be 117.

Is there a bug in 10.2.0 that I have not found or a parameter I have not used to build the boot loader that could fix this problem.

Cheers,
R




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