Re: Self introduction: Alain Vigne

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On Fri, Sep 7, 2018 at 8:23 AM Alain Vigne <alain.vigne.14@xxxxxxxxx> wrote:
>
> Hello ? No one interested ?
> How do I move forward ?

Hello!

Welcome to fedora, and sorry for the silence from the mailing list -
time before beta releases is usually quite busy.

I assume you have already read the wiki page on how to join the
packager group -
https://fedoraproject.org/wiki/Join_the_package_collection_maintainers

So, the next step is waiting for someone to sponsor you and review
your first package (doesn't necessarily need to be the same person).
It looks like Robert-André already provided feedback on your package,
so the only thing left is for a sponsor to show up. (I don't really
have the time for that right now.) Usually, new packagers are asked to
perform some non-binding reviews of pending packages to show that they
have read and understood the Guidelines (pick some recent ones from
https://fedoraproject.org/PackageReviewStatus/NEW.html).

Fabio

> On Mon, Sep 3, 2018 at 9:05 AM Alain Vigne <alain.vigne.14@xxxxxxxxx> wrote:
>>
>> Hi everyone,
>> I am Alain, a French EE engineer using Fedora 28 and EDA open source tools, for a long time now.
>>
>> I am part of the pcb-rnd developer upstream
>> http://repo.hu/projects/pcb-rnd/
>> and was able to produce a .spec file + SRPM rpm file + COPR successful builds:
>> https://copr.fedorainfracloud.org/coprs/avigne/pcb-rnd/
>>
>> Now, I am looking for a sponsor to officially get this package into Fedora. I filled this BZ bug:
>> https://bugzilla.redhat.com/show_bug.cgi?id=1581240
>>
>> I volunteer to be the package maintainer, I have read the guidelines and acknowledge responsibilities requested for such a task.
>> My FAS username is: avigne
>>
>> This package could also be part of FEL (Fedora Electronic Lab) spin, to be revived ? I am open to discussions about packaging latest versions of EE/CAD open source tools.
>>
>> Hoping for some positive feed-back...
>> Best regards
>> --
>> Alain V.
>
>
>
> --
> Alain V.
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