On 3 August 2015 21:56:47 BST, Matt Porter <mporter@xxxxxxxxxxxx> wrote: >This series adds a driver for the MAX6675 SPI thermocouple converter. >The device supports temperature measurements via type-K thermocouples >and implements cold-junction compensation within the part. The >datasheet >can be found at http://datasheets.maximintegrated.com/en/ds/MAX6675.pdf For a device like this where perhaps it's position wrt iio/hwmon boundary is unclear I want to see an argument for why IIO makes more sense in the cover letter + cc at least the hwmon MAINTAINERS if not the list... > >Matt Porter (3): > iio: temperature: add max6675 dt binding > iio: temperature: add max6675 thermocouple converter driver > MAINTAINERS: add max6675 driver > > .../bindings/iio/temperature/max6675.txt | 19 +++ > MAINTAINERS | 7 + > drivers/iio/temperature/Kconfig | 11 ++ > drivers/iio/temperature/Makefile | 1 + >drivers/iio/temperature/max6675.c | 155 >+++++++++++++++++++++ > 5 files changed, 193 insertions(+) >create mode 100644 >Documentation/devicetree/bindings/iio/temperature/max6675.txt > create mode 100644 drivers/iio/temperature/max6675.c -- Sent from my Android device with K-9 Mail. Please excuse my brevity. -- To unsubscribe from this list: send the line "unsubscribe devicetree" in the body of a message to majordomo@xxxxxxxxxxxxxxx More majordomo info at http://vger.kernel.org/majordomo-info.html
