Re: [PATCH v1] dt-bindings: qcom: geni-se: Rename qcom,geni-se.yaml to qcom,geni-se-qup.yaml

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On 24/02/2025 09:47, Viken Dadhaniya wrote:
> 
> 
> On 2/21/2025 5:05 PM, Krzysztof Kozlowski wrote:
>> On 21/02/2025 09:54, Viken Dadhaniya wrote:
>>> The qcom,geni-se.yaml file describes the Qualcomm Universal Peripheral
>>> (QUP) wrapper and the common entities required by QUP to run any Serial
>>> Engine (SE) as I2C, SPI, UART, or I3C protocol.
>>>
>>> Rename qcom,geni-se.yaml to qcom,geni-se-qup.yaml to better reflect its
>>> association with QUP (Qualcomm Universal Peripheral) and the compatible
>>> string.
>>>
>>> Signed-off-by: Viken Dadhaniya <quic_vdadhani@xxxxxxxxxxx>
>>> ---
>>>   .../soc/qcom/{qcom,geni-se.yaml => qcom,geni-se-qup.yaml}       | 2 +-
>>>   1 file changed, 1 insertion(+), 1 deletion(-)
>>>   rename Documentation/devicetree/bindings/soc/qcom/{qcom,geni-se.yaml => qcom,geni-se-qup.yaml} (98%)
>>>
>>
>> That's just churn for no real gain. Not even tested churn.
> 
> That's just churn for no real gain.
> 
> We made this change based on below plan, we think this will be helpful.
> 
> 1. Rename qcom,geni-se.yaml to qcom,geni-se-qup.yaml. Reason at 2 below.

There is no reason 2 at this point. You split your patchsets
incorrectly. At this point this is churn, without gain. No users of this
rename, no benefits.

> 2. Create qcom,geni-se.yaml with shared properties for SE-protocol (spi, 
> i2c, uart) nodes. This will be helpful for the shared schema in the 
> ongoing changes 

Then post it, instead of sending something which makes no sense on its own.


Best regards,
Krzysztof




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