On 30.01.2025 12:07, Daniel Lezcano wrote:
> On Thu, Jan 30, 2025 at 11:08:03AM +0200, Claudiu Beznea wrote:
>> Hi, Daniel,
>>
>> On 29.01.2025 19:24, Daniel Lezcano wrote:
>>> Hi Claudiu,
>>>
>>> On Fri, Jan 03, 2025 at 06:38:01PM +0200, Claudiu wrote:
>>>> From: Claudiu Beznea <claudiu.beznea.uj@xxxxxxxxxxxxxx>
>>>>
>>>> On the Renesas RZ/G3S (and other Renesas SoCs, e.g., RZ/G2{L, LC, UL}),
>>>> clocks are managed through PM domains. These PM domains, registered on
>>>> behalf of the clock controller driver, are configured with
>>>> GENPD_FLAG_PM_CLK. In most of the Renesas drivers used by RZ SoCs, the
>>>> clocks are enabled/disabled using runtime PM APIs.
>>>>
>>>> During probe, devices are attached to the PM domain controlling their
>>>> clocks. Similarly, during removal, devices are detached from the PM domain.
>>>>
>>>> The detachment call stack is as follows:
>>>>
>>>> device_driver_detach() ->
>>>> device_release_driver_internal() ->
>>>> __device_release_driver() ->
>>>> device_remove() ->
>>>> platform_remove() ->
>>>> dev_pm_domain_detach()
>>>>
>>>> In the upcoming Renesas RZ/G3S thermal driver, the
>>>> struct thermal_zone_device_ops::change_mode API is implemented to
>>>> start/stop the thermal sensor unit. Register settings are updated within
>>>> the change_mode API.
>>>>
>>>> In case devres helpers are used for thermal zone register/unregister the
>>>> struct thermal_zone_device_ops::change_mode API is invoked when the
>>>> driver is unbound. The identified call stack is as follows:
>>>>
>>>> device_driver_detach() ->
>>>> device_release_driver_internal() ->
>>>> device_unbind_cleanup() ->
>>>> devres_release_all() ->
>>>> devm_thermal_of_zone_release() ->
>>>> thermal_zone_device_disable() ->
>>>> thermal_zone_device_set_mode() ->
>>>> rzg3s_thermal_change_mode()
>>>>
>>>> The device_unbind_cleanup() function is called after the thermal device is
>>>> detached from the PM domain (via dev_pm_domain_detach()).
>>>>
>>>> The rzg3s_thermal_change_mode() implementation calls
>>>> pm_runtime_resume_and_get()/pm_runtime_put_autosuspend() before/after
>>>> accessing the registers. However, during the unbind scenario, the
>>>> devm_thermal_of_zone_release() is invoked after dev_pm_domain_detach().
>>>> Consequently, the clocks are not enabled, as the device is removed from
>>>> the PM domain at this time, leading to an Asynchronous SError Interrupt.
>>>> The system cannot be used after this.
>>>
>>> I've been through the driver before responding to this change. What is the
>>> benefit of powering down / up (or clock off / on) the thermal sensor when
>>> reading the temperature ?
>>>
>>> I can understand for disable / enable but I don't get for the classic usage
>>> where a governor will be reading the temperature regularly.
>>
>> I tried to be as power saving as possible both at runtime and after the IP
>> is not used anymore as the HW manual doesn't mentioned anything about
>> accuracy or implications of disabling the IP clock at runtime. We use
>> similar approach (of disabling clocks at runtime) for other IPs in the
>> RZ/G3S SoC as well.
>>
>>>
>>> Would the IP need some cycles to capture the temperature accurately after the
>>> clock is enabled ?
>>
>> There is nothing about this mentioned about this in the HW manual of the
>> RZ/G3S SoC. The only points mentioned are as described in the driver code:
>> - wait at least 3us after each IIO channel read
>> - wait at least 30us after enabling the sensor
>> - wait at least 50us after setting OE bit in TSU_SM
>>
>> For this I chose to have it implemented as proposed.
>
> IMO, disabling/enabling the clock between two reads through the pm runtime may
> not be a good thing, especially if the system enters a thermal situation where
> it has to mitigate.
>
> Without any testing capturing the temperatures and compare between the always-on
> and on/off, it is hard to say if it is true or not. Up to you to test that or
> not. If you think it is fine, then let's go with it.
I tested it with and w/o the runtime PM and on/off support (so, everything
ON from the probe) and the reported temperature values were similar.
Thank you,
Claudiu
>
>> If any, the HW manual is available here
>> https://www.renesas.com/en/document/mah/rzg3s-group-users-manual-hardware?r=25458591
>> (an archive is here; the manual is in Deliverables/r01uh1014ej0110-rzg3s.pdf)
>>
>> Thank you for your review,
>> Claudiu
>>
>>>
>>>> Add thermal_of_zone_register()/thermal_of_zone_unregister(). These will
>>>> be used in the upcomming RZ/G3S thermal driver.
>>>>
>>>> Signed-off-by: Claudiu Beznea <claudiu.beznea.uj@xxxxxxxxxxxxxx>
>>
>
