On 25/11/2024 09:52, Krzysztof Kozlowski wrote: > On 13/11/2024 04:05, Guenter Roeck wrote: >> On 11/12/24 18:39, Sung-Chi, Li wrote: >>> The cros_ec supports reading thermal values from thermal sensors >>> connect to it. Add the property '#thermal-sensor-cells' bindings, such >>> that thermal framework can recognize cros_ec as a valid thermal device. >>> >>> Signed-off-by: Sung-Chi, Li <lschyi@xxxxxxxxxxxx> >>> Acked-by: Conor Dooley <conor.dooley@xxxxxxxxxxxxx> >>> --- >>> Changes in v2: >>> - Add changes for DTS binding. >>> Changes in v3: >>> - Remove unneeded Change-Id tag in commit message. >>> --- >> >> I can't apply this one (not in hwmon space), so >> >> Acked-by: Guenter Roeck <linux@xxxxxxxxxxxx> >> >> with the assumption that Lee will pick it up. > > This was merged, while I was AFK, so the ship has sailed, but let me > state here objection for any future discussions: > > NAK, this is not a thermal sensor. The commit msg explains what they > want to achieve, but that's not a valid reason to add property from > different class of devices. > > This is some hardware/temperature monitoring device or power supply, not > part of SoC, not integrated into any SoC thermal zone. Calling it > thermal sensor is huge stretch and inappropriate hardware description > leading to next patches like calling it a SoC cooling device, instead of > simple power supply (for which we have bindings!). Ah, wait, this was not merged, so I can actually NAK it. BTW, all your patches are incorrectly ordered - bindings are always before the users. You cannot merge user of a binding without or before the binding. Best regards, Krzysztof
