From: kongxinwei <kong.kongxinwei@xxxxxxxxxxxxx> Thank you all for giving this RFC patches stages some comments. Here is v1 patches and address all the issues raised as part of RFC review. The Linaro connect introduce 96boards series in Hong Kong,The HiKey board is the first board to be certified 96Boards Consumer Edition compatible. This board is based on the HiSilicon SoC. you can get more information from https://www.96boards.org. The hisilicon SoC contains thermal module, this thermal module has 4 sensors, - sensor 0: local sensor; - sensor 1: remote sensor for ACPU cluster 1; - sensor 2: remote sensor for ACPU cluster 2; - sensor 3: remote sensor for GPU; It can obtain this device temperature by operating this hardware. The new sensor driver satisfies thermal framework and to realize the ACPU ,GPU and so on to cool function. Changes v0->v1; * Delete this hi6220 dtsi. * Fix documentation and error checks. * Modify this driver which makes use of kernel to decide dynamically bind the interrupt to hottest sensor. * Delete "sensor-thres-temp" property in DTS and write thermal_zone trips points value to register. * Delete "sensor-reset-temp" property and define the fixed value. kongxinwei (2): thermal: hisilicon: add new hisilicon thermal sensor driver dt-bindings: Document the hi6220 thermal sensor bindings .../bindings/thermal/hisilicon-thermal.txt | 45 ++ drivers/thermal/Kconfig | 8 + drivers/thermal/Makefile | 1 + drivers/thermal/hisi_thermal.c | 526 +++++++++++++++++++++ 4 files changed, 580 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt create mode 100644 drivers/thermal/hisi_thermal.c -- 1.9.1 -- To unsubscribe from this list: send the line "unsubscribe devicetree" in the body of a message to majordomo@xxxxxxxxxxxxxxx More majordomo info at http://vger.kernel.org/majordomo-info.html
