On Tue, Feb 03, 2015 at 11:24:45AM +0200, Ivan T. Ivanov wrote: > > Hi Eduardo, > > On Mon, 2015-02-02 at 14:14 -0400, Eduardo Valentin wrote: > > Ivan, > > > > On Mon, Feb 02, 2015 at 05:19:30PM +0200, Ivan T. Ivanov wrote: > > > Add support for the temperature alarm peripheral found inside > > > Qualcomm plug-and-play (QPNP) PMIC chips. The temperature alarm > > > peripheral outputs a pulse on an interrupt line whenever the > > > thermal over temperature stage value changes. > > > > > > Register a thermal sensor. The temperature reported by this thermal > > > sensor device should reflect the actual PMIC die temperature if an > > > ADC is present on the given PMIC. If no ADC is present, then the > > > reported temperature should be estimated from the over temperature > > > stage value. > > > > > > Cc: David Collins <collinsd@xxxxxxxxxxxxxx> > > > Signed-off-by: Ivan T. Ivanov <iivanov@xxxxxxxxxx> > > > --- > > > > > > Changes since v3: > > > > > > - Driver register thermal sensor instead thermal zone. Device thermal zone > > > should be properly described in DT files according thermal.txt document. > > > > Thanks a lot for keeping this up. I believe the driver looks smaller and > > cleaner now, don't you agree? > > Yep. > > > > > > - Dropped support for software override PMIC shutdown sequence and related > > > bit definitions. If software did not take action for clean device shutdown, > > > until critical temperature is reached, PMIC chip will execute internal > > > pre-programed shutdown sequence. > > > > > > > OK. Let me know if this functionality is crucial and needs further > > discussion. > > Unless I miss something, I think that this functionality is > used only for the purpose of debugging. OK Great! > > > > > > > I have two very minor comments as follows. > > > > > > > v3: http://comments.gmane.org/gmane.linux.ports.arm.msm/10071 > > > > > > .../bindings/thermal/qcom-spmi-temp-alarm.txt | 57 ++++ > > > drivers/thermal/Kconfig | 11 + > > > drivers/thermal/Makefile | 1 + > > > drivers/thermal/qcom-spmi-temp-alarm.c | 311 +++++++++++++++++++++ > > > 4 files changed, 380 insertions(+) > > > create mode 100644 Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt > > > create mode 100644 drivers/thermal/qcom-spmi-temp-alarm.c > > > > > > diff --git a/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt > > > b/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt > > > new file mode 100644 > > > index 0000000..290ec06 > > > --- /dev/null > > > +++ b/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt > > > @@ -0,0 +1,57 @@ > > > +Qualcomm QPNP PMIC Temperature Alarm > > > + > > > +QPNP temperature alarm peripherals are found inside of Qualcomm PMIC chips > > > +that utilize the Qualcomm SPMI implementation. These peripherals provide an > > > +interrupt signal and status register to identify high PMIC die temperature. > > > + > > > +Required properties: > > > +- compatible: Should contain "qcom,spmi-temp-alarm". > > > +- reg: Specifies the SPMI address and length of the controller's > > > + registers. > > > +- interrupts: PMIC temperature alarm interrupt. > > > +- #thermal-sensor-cells: Should be 0. See thermal.txt for a description. > > > + > > > +Optional properties: > > > +- io-channels: Should contain IIO channel specifier for the ADC channel, > > > + which report chip die temperature. > > > +- io-channel-names: Should contain "thermal". > > > + > > > +Example: > > > + > > > + pm8941_temp: thermal-alarm@2400 { > > > + compatible = "qcom,spmi-temp-alarm"; > > > + reg = <0x2400 0x100>; > > > + interrupts = <0 0x24 0 IRQ_TYPE_EDGE_RISING>; > > > + #thermal-sensor-cells = <0>; > > > + > > > + io-channels = <&pm8941_vadc VADC_DIE_TEMP>; > > > + io-channel-names = "thermal"; > > > + }; > > > + > > > + thermal-zones { > > > + pm8941 { > > > + polling-delay-passive = <250>; > > > + polling-delay = <1000>; > > > + > > > + thermal-sensors = <&pm8941_temp>; > > > + > > > + trips { > > > + passive { > > > + temperature = <1050000>; > > > + hysteresis = <2000>; > > > + type = "passive"; > > > + }; > > > + alert { > > > + temperature = <125000>; > > > + hysteresis = <2000>; > > > + type = "hot"; > > > + }; > > > + crit { > > > + temperature = <145000>; > > > + hysteresis = <2000>; > > > + type = "critical"; > > > + }; > > > + }; > > > + }; > > > + }; > > > > Do you have the appropriate DT changes under architecture code too? > > > > I mean, I am fine picking these changes, but should this series include > > also a minor inclusion under arch/arm/boot/dts too, given that you > > already did the hard part? > > We don't have any DT files for these PMIC's upstream. Probably is time > to start adding them. I have waiting to have some drivers accepted > before pushing such changes. But not we have 2 types of ADC, RTC, GPIO's, > MPP's and hopefully Thermal :-). I would like this to be a separate effort. I am fine if you take the approach of doing it in two steps. It is just that your series can be better reviewed if you include the DT changes. > > > > > + * This function updates the internal temp value based on the > > > + * current thermal stage and threshold as well as the previous stage > > > + */ > > > +static int qpnp_tm_update_temp_no_adc(struct qpnp_tm_chip *chip) > > > +{ > > > + unsigned int stage; > > > + int ret; > > > + u8 reg = 0; > > > + > > > + ret = qpnp_tm_read(chip, QPNP_TM_REG_STATUS, ®); > > > + if (ret < 0) > > > + return ret; > > > + > > > + stage = reg & STATUS_STAGE_MASK; > > > + > > > + if (stage > chip->stage) { > > > + /* increasing stage, use lower bound */ > > > + chip->temp = (stage - 1) * TEMP_STAGE_STEP + > > > + chip->thresh * TEMP_THRESH_STEP > > > + > > > + TEMP_STAGE_HYSTERESIS + > > > TEMP_THRESH_MIN; > > > + } else if (stage < chip->stage) { > > > + /* decreasing stage, use upper bound */ > > > + chip->temp = stage * TEMP_STAGE_STEP + > > > + chip->thresh * TEMP_THRESH_STEP > > > - > > > + TEMP_STAGE_HYSTERESIS + > > > TEMP_THRESH_MIN; > > > + } > > > > For my own edification, no change in state means no change in > > temperature too, right? > > More or less, just no way to estimate exact temperature > between stages. OK. > > > > > > + > > > + chip->stage = stage; > > > + > > > + return 0; > > > +} > > > + > > <snip> > > > > +static int qpnp_tm_probe(struct platform_device *pdev) > > > +{ > > > + struct qpnp_tm_chip *chip; > > > + struct device_node *node; > > > + u8 type, subtype; > > > + u32 res[2]; > > > + int ret, irq; > > > + > > > + node = pdev->dev.of_node; > > > + > > > + chip = devm_kzalloc(&pdev->dev, sizeof(*chip), GFP_KERNEL); > > > + if (!chip) > > > + return -ENOMEM; > > > + > > > + dev_set_drvdata(&pdev->dev, chip); > > > + > > > + chip->map = dev_get_regmap(pdev->dev.parent, NULL); > > > + if (!chip->map) > > > + return -ENXIO; > > > + > > > + ret = of_property_read_u32_array(node, "reg", res, 2); > > > + if (ret < 0) > > > + return ret; > > > + > > > + /* ADC based measurements are optional */ > > > + chip->adc = iio_channel_get(&pdev->dev, "thermal"); > > > + if (PTR_ERR(chip->adc) == -EPROBE_DEFER) > > > + return PTR_ERR(chip->adc); > > > + > > > + irq = platform_get_irq(pdev, 0); > > > + if (irq < 0) > > > + return irq; > > > + > > > + chip->base = res[0]; > > > + > > > + ret = qpnp_tm_read(chip, QPNP_TM_REG_TYPE, &type); > > > + if (ret < 0) { > > > + dev_err(&pdev->dev, "could not read type\n"); > > > + goto fail; > > > + } > > > + > > > + ret = qpnp_tm_read(chip, QPNP_TM_REG_SUBTYPE, &subtype); > > > + if (ret < 0) { > > > + dev_err(&pdev->dev, "could not read subtype\n"); > > > + goto fail; > > > + } > > > + > > > + if (type != QPNP_TM_TYPE || subtype != QPNP_TM_SUBTYPE) { > > > + dev_err(&pdev->dev, "invalid type 0x%02x or subtype 0x%02x\n", > > > + type, subtype); > > > + ret = -ENODEV; > > > + goto fail; > > > + } > > > + > > > + ret = qpnp_tm_init(chip); > > > + if (ret < 0) { > > > + dev_err(&pdev->dev, "init failed\n"); > > > + goto fail; > > > + } > > > + > > > + chip->tz_dev = thermal_zone_of_sensor_register(&pdev->dev, 0, chip, > > > + &qpnp_tm_sensor_ops); > > > + if (IS_ERR(chip->tz_dev)) { > > > + dev_err(&pdev->dev, "failed to register sensor\n"); > > > + ret = PTR_ERR(chip->tz_dev); > > > + goto fail; > > > + } > > > + > > > + ret = devm_request_threaded_irq(&pdev->dev, irq, NULL, qpnp_tm_isr, > > > + IRQF_ONESHOT, node->name, chip); > > > > What if we request this IRQ before registering the of thermal zone > > sensor? I believe it makes more sense conceptually, as you mean, you > > register into upper layers once your driver is fully ready to do so. > > > > Any objections changing the order? > > Sure. Good! > > > > > > + if (ret < 0) > > > + goto unreg; > > > + > > > + return 0; > > > + > > > +unreg: > > > + thermal_zone_of_sensor_unregister(&pdev->dev, chip->tz_dev); > > > > As mentioned by Stanimir Varban, you may also remove the above, since > > the irq is devm. > > Sure. s/Varban/Varbanov/ ;-) Ohh.. my bad. Sorry Varbanov. Fixing next time! :-) > > Thank you. > Ivan BR, Eduardo Valentin
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