Re: [PATCH v2] arm64: dts: rockchip: enable built-in thermal monitoring on rk3588

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On 2024-01-09 20:19, Alexey Charkov wrote:
Include thermal zones information in device tree for rk3588 variants
and enable the built-in thermal sensing ADC on RADXA Rock 5B

Signed-off-by: Alexey Charkov <alchark@xxxxxxxxx>
---
Changes in v2:
 - Dropped redundant comments
 - Included all CPU cores in cooling maps
 - Split cooling maps into more granular ones utilizing TSADC
   channels 1-3 which measure temperature by separate CPU clusters
   instead of channel 0 which measures the center of the SoC die
---
 .../boot/dts/rockchip/rk3588-rock-5b.dts      |   4 +
 arch/arm64/boot/dts/rockchip/rk3588s.dtsi     | 151 ++++++++++++++++++
 2 files changed, 155 insertions(+)

diff --git a/arch/arm64/boot/dts/rockchip/rk3588-rock-5b.dts
b/arch/arm64/boot/dts/rockchip/rk3588-rock-5b.dts
index a5a104131403..f9d540000de3 100644
--- a/arch/arm64/boot/dts/rockchip/rk3588-rock-5b.dts
+++ b/arch/arm64/boot/dts/rockchip/rk3588-rock-5b.dts
@@ -772,3 +772,7 @@ &usb_host1_ehci {
 &usb_host1_ohci {
 	status = "okay";
 };
+
+&tsadc {
+	status = "okay";
+};

I keep forgetting to note that enabling it for the Rock 5B should
be performed in a separate patch.

diff --git a/arch/arm64/boot/dts/rockchip/rk3588s.dtsi
b/arch/arm64/boot/dts/rockchip/rk3588s.dtsi
index 8aa0499f9b03..8d54998d0ecc 100644
--- a/arch/arm64/boot/dts/rockchip/rk3588s.dtsi
+++ b/arch/arm64/boot/dts/rockchip/rk3588s.dtsi
@@ -10,6 +10,7 @@
 #include <dt-bindings/reset/rockchip,rk3588-cru.h>
 #include <dt-bindings/phy/phy.h>
 #include <dt-bindings/ata/ahci.h>
+#include <dt-bindings/thermal/thermal.h>

 / {
 	compatible = "rockchip,rk3588";
@@ -2112,6 +2113,156 @@ tsadc: tsadc@fec00000 {
 		status = "disabled";
 	};

+	thermal_zones: thermal-zones {
+		/* sensor near the center of the whole chip */
+		soc_thermal: soc-thermal {
+			polling-delay-passive = <20>;
+			polling-delay = <1000>;
+			sustainable-power = <2100>;
+			thermal-sensors = <&tsadc 0>;
+
+			trips {
+				soc_crit: soc-crit {
+					temperature = <115000>;
+					hysteresis = <2000>;
+					type = "critical";
+				};
+			};
+		};

As already noted in my previous response, perhaps it whould be
better to name it package_thermal instead.  That way, it should
be more self descriptive.

+		/* sensor between A76 cores 0 and 1 */
+		bigcore0_thermal: bigcore0-thermal {
+			polling-delay-passive = <20>;
+			polling-delay = <1000>;
+			thermal-sensors = <&tsadc 1>;
+
+			trips {
+				bigcore0_alert: bigcore0-alert {
+					temperature = <85000>;
+					hysteresis = <2000>;
+					type = "passive";
+				};
+				bigcore0_crit: bigcore0-crit {
+					temperature = <115000>;
+					hysteresis = <2000>;
+					type = "critical";
+				};
+			};

As already noted in my previous message, perhaps another trip,
of the "hot" type, should be added here.

+			cooling-maps {
+				map0 {
+					trip = <&bigcore0_alert>;
+					cooling-device =
+						<&cpu_b0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>,
+						<&cpu_b1 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
+					contribution = <1024>;
+				};
+			};
+		};
+
+		/* sensor between A76 cores 2 and 3 */
+		bigcore2_thermal: bigcore2-thermal {
+			polling-delay-passive = <20>;
+			polling-delay = <1000>;
+			thermal-sensors = <&tsadc 2>;
+
+			trips {
+				bigcore2_alert: bigcore2-alert {
+					temperature = <85000>;
+					hysteresis = <2000>;
+					type = "passive";
+				};
+				bigcore2_crit: bigcore2-crit {
+					temperature = <115000>;
+					hysteresis = <2000>;
+					type = "critical";
+				};
+			};

The same suggestion about one more "hot" trip applies here as well.

+			cooling-maps {
+				map1 {
+					trip = <&bigcore2_alert>;
+					cooling-device =
+						<&cpu_b2 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>,
+						<&cpu_b3 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
+					contribution = <1024>;
+				};
+			};
+		};
+
+		/* sensor between the four A55 cores */
+		little_core_thermal: littlecore-thermal {
+			polling-delay-passive = <20>;
+			polling-delay = <1000>;
+			thermal-sensors = <&tsadc 3>;
+
+			trips {
+				littlecore_alert: littlecore-alert {
+					temperature = <85000>;
+					hysteresis = <2000>;
+					type = "passive";
+				};
+				littlecore_crit: littlecore-crit {
+					temperature = <115000>;
+					hysteresis = <2000>;
+					type = "critical";
+				};
+			};

The same suggestion about one more "hot" trip applies here as well.

+			cooling-maps {
+				map2 {
+					trip = <&littlecore_alert>;
+					cooling-device =
+						<&cpu_l0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>,
+						<&cpu_l1 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>,
+						<&cpu_l2 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>,
+						<&cpu_l3 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
+					contribution = <1024>;
+				};
+			};
+		};
+
+		/* sensor near the PD_CENTER power domain */
+		center_thermal: center-thermal {
+			polling-delay-passive = <20>;
+			polling-delay = <1000>;
+			thermal-sensors = <&tsadc 4>;
+
+			trips {
+				center_crit: center-crit {
+					temperature = <115000>;
+					hysteresis = <2000>;
+					type = "critical";
+				};
+			};
+		};
+
+		gpu_thermal: gpu-thermal {
+			polling-delay-passive = <20>;
+			polling-delay = <1000>;
+			thermal-sensors = <&tsadc 5>;
+
+			trips {
+				gpu_crit: gpu-crit {
+					temperature = <115000>;
+					hysteresis = <2000>;
+					type = "critical";
+				};
+			};
+		};
+
+		npu_thermal: npu-thermal {
+			polling-delay-passive = <20>;
+			polling-delay = <1000>;
+			thermal-sensors = <&tsadc 6>;
+
+			trips {
+				npu_crit: npu-crit {
+					temperature = <115000>;
+					hysteresis = <2000>;
+					type = "critical";
+				};
+			};
+		};
+	};
+
 	saradc: adc@fec10000 {
 		compatible = "rockchip,rk3588-saradc";
 		reg = <0x0 0xfec10000 0x0 0x10000>;




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