On Mon, Oct 16, 2023 at 08:11:17PM -0700, Bjorn Andersson wrote: > The Qualcomm USB block consists of three intertwined parts, the XHCI, > the DWC3 core and the Qualcomm DWC3 glue. The exsting binding represents > the Qualcomm glue part, with the other two represented as in a child > node. > > Rename the qcom,dwc3 binding, to represent that this is indeed only the > glue part, to make room for a combined binding. > > The large "select" is included to avoid the schema to be selected for > validation with the upcoming flattened binding - which includes > snps,dwc3 in the compatible. > > Signed-off-by: Bjorn Andersson <quic_bjorande@xxxxxxxxxxx> > --- > -title: Qualcomm SuperSpeed DWC3 USB SoC controller > +title: Qualcomm SuperSpeed DWC3 USB SoC controller glue > + > +description: > + This describes the Qualcomm glue-section of the SuperSpeed DWC3 USB > + controller found in many Qualcomm platforms, with the XHCI and DWC3 core This should be "xHCI" throughout the series. > + portions described as a separate child device. > + The combined representation, defined by qcom,dwc3.yaml is preferred. Johan
