On Mon, Oct 02, 2023 at 09:43:08PM +0530, Manivannan Sadhasivam wrote: > On Mon, Oct 02, 2023 at 07:00:27PM +0300, Dmitry Baryshkov wrote: > > On Mon, 2 Oct 2023 at 18:58, Manivannan Sadhasivam <mani@xxxxxxxxxx> wrote: > > > > > > On Mon, Oct 02, 2023 at 06:00:37PM +0300, Dmitry Baryshkov wrote: > > > > On Mon, 2 Oct 2023 at 17:52, Manivannan Sadhasivam <mani@xxxxxxxxxx> wrote: > > > > > > > > > > On Sun, Oct 01, 2023 at 06:26:14PM +0100, Caleb Connolly wrote: > > > > > > > > > > > > > > > > > > On 01/10/2023 16:57, Manivannan Sadhasivam wrote: > > > > > > > On Fri, Sep 29, 2023 at 05:16:16PM +0100, Caleb Connolly wrote: > > > > > > > > The Thermal Mitigation Device (TMD) Service is a QMI service that runs > > > > > > > > on remote subsystems (the modem and DSPs) on Qualcomm SoCs. > > > > > > > > It exposes various mitigations including passive thermal controls and > > > > > > > > rail voltage restrictions. > > > > > > > > > > > > > > > > This series introduces support for exposing TMDs as cooling devices > > > > > > > > in the kernel through the thermal framework, using the QMI interface. > > > > > > > > > > > > > > > > Each TMD client is described as a child of the remoteproc node in > > > > > > > > devicetree. With subnodes for each control. > > > > > > > > > > > > > > > > > > > > > > Daniel expressed concerns in the past aganist representing TMD driver as a > > > > > > > cooling device since it is not tied to thermal zones and the governors cannot > > > > > > > use it. Instead he suggested to represent it as a powercap device with thermal > > > > > > > constraints. > > > > > > > > > > > > Hi Mani, > > > > > > > > > > > > Forgive me as I'm not yet super familiar with the thermal subsystem. > > > > > > > > > > > > As I understand it, the DT layout here enables each control to be referenced > > > > > > under the thermal zones, at least this is the approach taken in CAF 4.9. > > > > > > > > > > > > Maybe I don't quite understand what you mean, are you saying that using > > > > > > thermal zones is the wrong approach? > > > > > > > > > > Thermal framework expects each thermal zone represented in DT to have atleast > > > > > one corresponding thermal sensor defined using "thermal-sensors" property. But > > > > > with TMD, there is no thermal sensor AFAIK. > > > > > > > > As far as I understand, no. It is perfectly fine to have 'cooling' > > > > devices, which react to external thermal monitoring events. I might be > > > > mistaken, but I think that is the case here, isn't it? > > > > > > > > > > Yes it is represented as cooling device(s). But I do not see any cognizant way > > > to plug it with thermal zones i.e., unless TMD itself reports temperature of the > > > modem, using it as a cooling device for external temperature events doesn't > > > sound good to me. > > > > Why? We have compute, q6, wlan tsens sensors. So it seems natural to > > tell CDSP to slow down if compute sensor reports overheating. > > > > TMD is for external devices such as PCIe modems as well. Is there a temperature > sensor for that? > According to the schematics for the SC8280XP CRD sys_therm5 would be the sensor you're looking for. Regards, Bjorn
