Add devicetree binding document for TMP006, IR thermopile sensor.
Signed-off-by: Anup Sharma <anupnewsmail@xxxxxxxxx>
---
Changes:
V1 -> V2: Removed redundant dt-binding from subject.
Added supply information.
Adhere to the generic node name.
Adding missing semicolon to fix syntax error detected
using dt_binding_check
---
.../bindings/iio/temperature/ti,tmp006.yaml | 42 +++++++++++++++++++
1 file changed, 42 insertions(+)
create mode 100644 Documentation/devicetree/bindings/iio/temperature/ti,tmp006.yaml
diff --git a/Documentation/devicetree/bindings/iio/temperature/ti,tmp006.yaml b/Documentation/devicetree/bindings/iio/temperature/ti,tmp006.yaml
new file mode 100644
index 000000000000..d43002b9bfdc
--- /dev/null
+++ b/Documentation/devicetree/bindings/iio/temperature/ti,tmp006.yaml
@@ -0,0 +1,42 @@
+# SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause)
+%YAML 1.2
+---
+$id: http://devicetree.org/schemas/iio/temperature/ti,tmp006.yaml#
+$schema: http://devicetree.org/meta-schemas/core.yaml#
+
+title: TI TMP006 IR thermopile sensor
+
+maintainers:
+ - Peter Meerwald <pmeerw@xxxxxxxxxx>
+
+description: |
+ TI TMP006 - Infrared Thermopile Sensor in Chip-Scale Package.
+ https://cdn.sparkfun.com/datasheets/Sensors/Temp/tmp006.pdf
+
+properties:
+ compatible:
+ const: ti,tmp006
+
+ reg:
+ maxItems: 1
+
+ vdd-supply:
+ description: provide VDD power to the sensor.
+
+required:
+ - compatible
+ - reg
+
+additionalProperties: false
+
+examples:
+ - |
+ i2c {
+ #address-cells = <1>;
+ #size-cells = <0>;
+ temperature-sensor@40 {
+ compatible = "ti,tmp006";
+ reg = <0x40>;
+ vdd-supply = <&ldo4_reg>;
+ };
+ };
--
2.34.1
