Re: [PATCH v1 1/4] dt-bindings: thermal: tsens: Add ipq9574 compatible

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On 03/05/2023 06:45, Varadarajan Narayanan wrote:
> From: Praveenkumar I <quic_ipkumar@xxxxxxxxxxx>
> 
> Qualcomm IPQ9574 has tsens v2.3.1 block, which is similar to IPQ8074 tsens.
> 
> Signed-off-by: Praveenkumar I <quic_ipkumar@xxxxxxxxxxx>
> Signed-off-by: Varadarajan Narayanan <quic_varada@xxxxxxxxxxx>
> ---
>  Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 3 +++
>  1 file changed, 3 insertions(+)
> 

I saw already v1, so this looks like v2, not v1. Please add changelog
describing what you changed here.

> diff --git a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
> index d1ec963..8e2208c 100644
> --- a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
> +++ b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
> @@ -66,6 +66,7 @@ properties:
>        - description: v2 of TSENS with combined interrupt
>          enum:
>            - qcom,ipq8074-tsens
> +          - qcom,ipq9574-tsens

This is a friendly reminder during the review process.

It seems my previous comments were not fully addressed. Maybe my
feedback got lost between the quotes, maybe you just forgot to apply it.
Please go back to the previous discussion and either implement all
requested changes or keep discussing them.

Thank you.


Best regards,
Krzysztof




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