Hi, On Tue, 24 Jan 2023 12:39:08 +0100, Neil Armstrong wrote: > Add an active trip tied to the on-board fan cooling device, which is better > than describing it along the passive cooling maps. > > Thanks, Applied to https://git.kernel.org/pub/scm/linux/kernel/git/amlogic/linux.git (v6.3/arm64-dt) [1/1] arm64: dts: amlogic: meson-sm1-odroid-hc4: fix active fan thermal trip https://git.kernel.org/amlogic/c/1d2f14117aa7773efff50f832b85fc7779e586e0 These changes has been applied on the intermediate git tree [1]. The v6.3/arm64-dt branch will then be sent via a formal Pull Request to the Linux SoC maintainers for inclusion in their intermediate git branches in order to be sent to Linus during the next merge window, or sooner if it's a set of fixes. In the cases of fixes, those will be merged in the current release candidate kernel and as soon they appear on the Linux master branch they will be backported to the previous Stable and Long-Stable kernels [2]. The intermediate git branches are merged daily in the linux-next tree [3], people are encouraged testing these pre-release kernels and report issues on the relevant mailing-lists. If problems are discovered on those changes, please submit a signed-off-by revert patch followed by a corrective changeset. [1] https://git.kernel.org/pub/scm/linux/kernel/git/amlogic/linux.git [2] https://git.kernel.org/pub/scm/linux/kernel/git/stable/linux.git [3] https://git.kernel.org/pub/scm/linux/kernel/git/next/linux-next.git -- Neil
