On 13/12/2022 09:24, Kunihiko Hayashi wrote: > Add DT binding schema for components belonging to the platform-specific > DWC3 USB glue layer implemented in UniPhier SoCs. > > This USB glue layer works as a sideband logic for the host controller, > including core reset, vbus control, PHYs, and some signals to the > controller. > > Signed-off-by: Kunihiko Hayashi <hayashi.kunihiko@xxxxxxxxxxxxx> > --- > .../socionext,uniphier-dwc3-glue.yaml | 106 ++++++++++++++++++ > 1 file changed, 106 insertions(+) > create mode 100644 Documentation/devicetree/bindings/soc/socionext/socionext,uniphier-dwc3-glue.yaml > > diff --git a/Documentation/devicetree/bindings/soc/socionext/socionext,uniphier-dwc3-glue.yaml b/Documentation/devicetree/bindings/soc/socionext/socionext,uniphier-dwc3-glue.yaml > new file mode 100644 > index 000000000000..bd0def7236b5 > --- /dev/null > +++ b/Documentation/devicetree/bindings/soc/socionext/socionext,uniphier-dwc3-glue.yaml > @@ -0,0 +1,106 @@ > +# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause) > +%YAML 1.2 Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@xxxxxxxxxx> Best regards, Krzysztof
