Re: [PATCH v2 02/12] dt-bindings: thermal: tsens: Add SM6115 compatible

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On Wed, 30 Nov 2022 21:09:40 +0100, Adam Skladowski wrote:
> Document compatible for tsens on Qualcomm SM6115 platform
> according to downstream dts it ship v2.4 of IP
> 
> Signed-off-by: Adam Skladowski <a39.skl@xxxxxxxxx>
> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@xxxxxxxxxx>
> ---
>  Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 1 +
>  1 file changed, 1 insertion(+)
> 

Since Daniel is out, applied, thanks!



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