On Thu, Sep 18, 2014 at 04:19:26PM +0200, Tomeu Vizoso wrote: > On 18 September 2014 15:25, Caesar Wang <caesar.wang@xxxxxxxxxxxxxx> wrote: > > Tomeu, > > > > 在 2014年09月18日 17:27, Tomeu Vizoso 写道: > >> > >> On 17 September 2014 05:59, Caesar Wang <caesar.wang@xxxxxxxxxxxxxx> > >> wrote: > >>> > >>> This add the necessary binding documentation for the thermal > >>> found on Rockchip SoCs > >> > >> Hi Caesar, > >> > >> is there any reason to not use the existing thermal bindings? You can > >> find a description in > >> Documentation/devicetree/bindings/thermal/thermal.txt and example code > >> in omap, or in the patches for Tegra recently posted by Mikko > >> Perttunen. > >> > >> Regards, > >> > >> Tomeu > > > > > > Why should I use the existing thermal bindings? > > Because otherwise, you are asking to merge duplicated code. There's a > generic way to define thermal zones, trip points, cooling devices, > etc. And also code to parse and plug them together. Why add > soc-specific code to do the same? > > > I believe omap,tegar and rockchip are the three seperate thermals driver. > > Yes, and OMAP is already using the generic bindings, and the proposed > patches for Tegra as well, and I think it would make sense for > Rockchip to also use them (unless I'm missing something). You are talking about drivers/thermal/of-thermal.c, right? Yes, I think Rockchip should be using the same generic framework if possible. Thanks. -- Dmitry -- To unsubscribe from this list: send the line "unsubscribe devicetree" in the body of a message to majordomo@xxxxxxxxxxxxxxx More majordomo info at http://vger.kernel.org/majordomo-info.html
