The thermal framework accepts now the cpu idle cooling device as an
alternative when the cpufreq cooling device fails.
Add the node in the DT so the cooling devices will be present and the
platforms can extend the thermal zone definition to add them.
Signed-off-by: Daniel Lezcano <daniel.lezcano@xxxxxxxxxx>
---
arch/arm64/boot/dts/rockchip/rk3399.dtsi | 10 ++++++++++
1 file changed, 10 insertions(+)
diff --git a/arch/arm64/boot/dts/rockchip/rk3399.dtsi b/arch/arm64/boot/dts/rockchip/rk3399.dtsi
index 3871c7fd83b0..9ac232ffd284 100644
--- a/arch/arm64/boot/dts/rockchip/rk3399.dtsi
+++ b/arch/arm64/boot/dts/rockchip/rk3399.dtsi
@@ -124,6 +124,11 @@ cpu_b0: cpu@100 {
#cooling-cells = <2>; /* min followed by max */
dynamic-power-coefficient = <436>;
cpu-idle-states = <&CPU_SLEEP &CLUSTER_SLEEP>;
+ thermal-idle {
+ #cooling-cells = <2>;
+ duration-us = <10000>;
+ exit-latency-us = <500>;
+ };
};
cpu_b1: cpu@101 {
@@ -136,6 +141,11 @@ cpu_b1: cpu@101 {
#cooling-cells = <2>; /* min followed by max */
dynamic-power-coefficient = <436>;
cpu-idle-states = <&CPU_SLEEP &CLUSTER_SLEEP>;
+ thermal-idle {
+ #cooling-cells = <2>;
+ duration-us = <10000>;
+ exit-latency-us = <500>;
+ };
};
idle-states {
--
2.25.1
