Re: [PATCH v3 4/6] dt-bindings: remoteproc: Add bindings for C66x DSPs on TI K3 SoCs

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On Fri, 12 Jun 2020 17:49:12 -0500, Suman Anna wrote:
> Some Texas Instruments K3 family of SoCs have one of more Digital Signal
> Processor (DSP) subsystems that are comprised of either a TMS320C66x
> CorePac and/or a next-generation TMS320C71x CorePac processor subsystem.
> Add the device tree bindings document for the C66x DSP devices on these
> SoCs. The added example illustrates the DT nodes for the first C66x DSP
> device present on the K3 J721E family of SoCs.
> 
> Signed-off-by: Suman Anna <s-anna@xxxxxx>
> ---
> v3:
>  - Refactored the common ti-sci properties "ti,sci", "ti,sci-dev-id" and
>    "ti,sci-proc-ids" into a separate binding ti,k3-sci-proc.yaml.
>  - Dropped the general description and maxItems against reg and reg-names
>  - Added items list under reg
>  - Removed the other binding references from the description for resets
>    and mboxes
>  - Revised the memory-region description and listed the mandatory items
>  - Updated example to drop reserved-memory nodes, unused node labels
> v2: https://patchwork.kernel.org/patch/11561781/
> 
>  .../bindings/remoteproc/ti,k3-dsp-rproc.yaml  | 139 ++++++++++++++++++
>  1 file changed, 139 insertions(+)
>  create mode 100644 Documentation/devicetree/bindings/remoteproc/ti,k3-dsp-rproc.yaml
> 

Reviewed-by: Rob Herring <robh@xxxxxxxxxx>



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