Re: [PATCH 1/5] dt-bindings: thermal: qcom: add adc-thermal monitor bindings

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On Sun, 21 Jun 2020 22:35:45 +0300, Dmitry Baryshkov wrote:
> Add bindings for thermal monitor, part of Qualcomm PMIC5 chips. It is a
> close counterpart of VADC part of those PMICs.
> 
> Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@xxxxxxxxxx>
> ---
>  .../bindings/thermal/qcom-spmi-adc-tm5.yaml   | 143 ++++++++++++++++++
>  1 file changed, 143 insertions(+)
>  create mode 100644 Documentation/devicetree/bindings/thermal/qcom-spmi-adc-tm5.yaml
> 


My bot found errors running 'make dt_binding_check' on your patch:

Documentation/devicetree/bindings/thermal/qcom-spmi-adc-tm5.yaml:  while scanning a block scalar
  in "<unicode string>", line 114, column 5
found a tab character where an indentation space is expected
  in "<unicode string>", line 115, column 1
Documentation/devicetree/bindings/Makefile:20: recipe for target 'Documentation/devicetree/bindings/thermal/qcom-spmi-adc-tm5.example.dts' failed
make[1]: *** [Documentation/devicetree/bindings/thermal/qcom-spmi-adc-tm5.example.dts] Error 1
make[1]: *** Waiting for unfinished jobs....
Makefile:1347: recipe for target 'dt_binding_check' failed
make: *** [dt_binding_check] Error 2


See https://patchwork.ozlabs.org/patch/1313977

If you already ran 'make dt_binding_check' and didn't see the above
error(s), then make sure dt-schema is up to date:

pip3 install git+https://github.com/devicetree-org/dt-schema.git@master --upgrade

Please check and re-submit.




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