Re: [PATCH v5 1/7] interconnect: qcom: Allow icc node to be used across icc providers

[Date Prev][Date Next][Thread Prev][Thread Next][Date Index][Thread Index]

Subject: Re: [PATCH v5 1/7] interconnect: qcom: Allow icc node to be used across icc providers
From: Evan Green <evgreen@xxxxxxxxxxxx>
Date: Fri, 28 Feb 2020 16:21:30 -0800
Cc: Rob Herring <robh+dt@xxxxxxxxxx>, Georgi Djakov <georgi.djakov@xxxxxxxxxx>, Bjorn Andersson <bjorn.andersson@xxxxxxxxxx>, Andy Gross <agross@xxxxxxxxxx>, LKML <linux-kernel@xxxxxxxxxxxxxxx>, "open list:OPEN FIRMWARE AND FLATTENED DEVICE TREE BINDINGS" <devicetree@xxxxxxxxxxxxxxx>, linux-arm-msm <linux-arm-msm@xxxxxxxxxxxxxxx>, Mark Rutland <mark.rutland@xxxxxxx>, Saravana Kannan <saravanak@xxxxxxxxxx>, Viresh Kumar <viresh.kumar@xxxxxxxxxx>, Odelu Kukatla <okukatla@xxxxxxxxxxxxxx>
In-reply-to: <20200227105632.15041-2-sibis@codeaurora.org>

On Thu, Feb 27, 2020 at 2:57 AM Sibi Sankar <sibis@xxxxxxxxxxxxxx> wrote:
>
> Move the icc node ids to a common header, this will allow for
> referencing/linking of icc nodes to multiple icc providers on
> SDM845 SoCs.
>
> Signed-off-by: Sibi Sankar <sibis@xxxxxxxxxxxxxx>

Reviewed-by: Evan Green <evgreen@xxxxxxxxxxxx>

References:
- [PATCH v5 0/7] Add OSM L3 Interconnect Provider
  - From: Sibi Sankar
- [PATCH v5 1/7] interconnect: qcom: Allow icc node to be used across icc providers
  - From: Sibi Sankar

Prev by Date: Re: [PATCH v5 7/7] arm64: dts: qcom: sc7180: Add OSM L3 interconnect provider
Next by Date: [PATCH v2 2/2] kbuild: Build DT binding examples with dtc warnings enabled
Previous by thread: [PATCH v5 1/7] interconnect: qcom: Allow icc node to be used across icc providers
Next by thread: [PATCH v5 4/7] dt-bindings: interconnect: Add OSM L3 DT binding on SC7180
Index(es):
- Date
- Thread

[Index of Archives] [Device Tree Compilter] [Device Tree Spec] [Linux Driver Backports] [Video for Linux] [Linux USB Devel] [Linux PCI Devel] [Linux Audio Users] [Linux Kernel] [Linux SCSI] [XFree86] [Yosemite Backpacking]