On 06.09.2018 14:04, Icenowy Zheng wrote:
于 2018年9月6日 GMT+08:00 下午7:51:15, Maxime Ripard <maxime.ripard@xxxxxxxxxxx> 写到:
On Thu, Sep 06, 2018 at 01:47:47PM +0200, Philipp Rossak wrote:
On 04.09.2018 18:46, Emmanuel Vadot wrote:
+ /* Data cells */
+ thermal_calibration: calib@234 {
+ reg = <0x234 0x8>;
+ };
You are declaring 8 bytes of calibration data but to my knowledge
it's
only 2 bytes per sensor, so 2 bytes for H3.
Am I missing something ?
Thanks,
Emmanuel you are right, it is 2 bytes per Sensor and should be 2
bytes for
H3, but the thermal calibration data field is on all chips 64 bit
wide - so
8 bytes. So I'm reading here the complete calibration data field.
Having one cell per channel would make more sense I guess.
Ok I will change this.
I have mentioned that this is impossible because of wrong
addressing caused by LE2BE in SID driver.
I know! But I would like to prepare patches for it, that they can be
merged when this is fixed.
Philipp
