This provides initial patchset for ADSP PIL driver for SDM845. Changes since v2: Separated dt-bindings documentation into separate patch. Used clk_bulk APIs for adsp clocks. Used power domain API and use reference to rpmhd resource. Renamed qcom_nonpas_adsp_pil.c to qcom_adsp_pil.c Removed smd as sdm845 does not support smd. Removed px_supply and aggre2_clk for sdm845 as they are not required. Removed reg-names as there is only one register. This patch is dependent on the rpmh powerdomain driver https://lkml.org/lkml/2018/6/27/7 and renaming of Hexagon v5 PAS driver https://lkml.org/lkml/2018/8/28/129 . Rohit kumar (2): dt-binding: remoteproc: Add QTI ADSP PIL bindings remoteproc: qcom: Introduce Non-PAS ADSP PIL driver .../bindings/remoteproc/qcom,adsp-pil.txt | 123 +++++ drivers/remoteproc/Kconfig | 14 + drivers/remoteproc/Makefile | 1 + drivers/remoteproc/qcom_adsp_pil.c | 500 +++++++++++++++++++++ 4 files changed, 638 insertions(+) create mode 100644 Documentation/devicetree/bindings/remoteproc/qcom,adsp-pil.txt create mode 100644 drivers/remoteproc/qcom_adsp_pil.c -- Qualcomm India Private Limited, on behalf of Qualcomm Innovation Center, Inc., is a member of Code Aurora Forum, a Linux Foundation Collaborative Project.
