On Wed, 21 Feb 2018 19:32:32 +0000 Bean Huo <beanhuo@xxxxxxxxxxx> wrote: > From: beanhuo <beanhuo@xxxxxxxxxx> > > This commit adds the dual die entry in the devicetree binding > for the daul die stacked parallel NOR. > > Signed-off-by: beanhuo <beanhuo@xxxxxxxxxx> > --- > Documentation/devicetree/bindings/mtd/mtd-physmap.txt | 2 ++ > 1 file changed, 2 insertions(+) > > diff --git a/Documentation/devicetree/bindings/mtd/mtd-physmap.txt b/Documentation/devicetree/bindings/mtd/mtd-physmap.txt > index 4a0a48b..782bacc 100644 > --- a/Documentation/devicetree/bindings/mtd/mtd-physmap.txt > +++ b/Documentation/devicetree/bindings/mtd/mtd-physmap.txt > @@ -29,6 +29,8 @@ file systems on embedded devices. > - use-advanced-sector-protection: boolean to enable support for the > advanced sector protection (Spansion: PPB - Persistent Protection > Bits) locking. > + - dual-die-stack: boolean to enable support for the devices with the > + two dies in stack. How about making that more future proof and adding a property that directly contains the number of dies (num-dies)? > > For JEDEC compatible devices, the following additional properties > are defined: -- Boris Brezillon, Bootlin (formerly Free Electrons) Embedded Linux and Kernel engineering https://bootlin.com -- To unsubscribe from this list: send the line "unsubscribe devicetree" in the body of a message to majordomo@xxxxxxxxxxxxxxx More majordomo info at http://vger.kernel.org/majordomo-info.html
