On Wed, Sep 20, 2017 at 08:04:02AM +0000, Icenowy Zheng wrote:
> 于 2017年9月20日 GMT+08:00 下午3:52:23, Maxime Ripard <maxime.ripard@xxxxxxxxxxxxxxxxxx> 写到:
> >On Mon, Sep 18, 2017 at 03:47:25PM +0000, icenowy@xxxxxxx wrote:
> >> 在 2017-09-18 16:30，Maxime Ripard 写道：
> >> > On Mon, Sep 18, 2017 at 03:36:43PM +0800, Icenowy Zheng wrote:
> >> > > 于 2017年9月18日 GMT+08:00 下午3:33:36, Maxime Ripard
> >> > > <maxime.ripard@xxxxxxxxxxxxxxxxxx> 写到:
> >> > > >On Thu, Sep 14, 2017 at 10:52:46PM +0800, Icenowy Zheng wrote:
> >> > > >> Allwinner H3 features a thermal sensor like the one in A33,
> >but has
> >> > > >its
> >> > > >> register re-arranged, the clock divider moved to CCU
> >(originally the
> >> > > >> clock divider is in ADC) and added a pair of bus clock and
> >reset.
> >> > > >>
> >> > > >> Update the binding document to cover H3.
> >> > > >>
> >> > > >> Signed-off-by: Icenowy Zheng <icenowy@xxxxxxx>
> >> > > >> Reviewed-by: Chen-Yu Tsai <wens@xxxxxxxx>
> >> > > >> ---
> >> > > >> Changes in v4:
> >> > > >> - Add nvmem calibration data (not yet used by the driver)
> >> > > >> Changes in v3:
> >> > > >> - Clock name changes.
> >> > > >> - Example node name changes.
> >> > > >> - Add interupts (not yet used by the driver).
> >> > > >>
> >> > > >> .../devicetree/bindings/mfd/sun4i-gpadc.txt | 30
> >> > > >++++++++++++++++++++--
> >> > > >> 1 file changed, 28 insertions(+), 2 deletions(-)
> >> > > >>
> >> > > >> diff --git
> >a/Documentation/devicetree/bindings/mfd/sun4i-gpadc.txt
> >> > > >b/Documentation/devicetree/bindings/mfd/sun4i-gpadc.txt
> >> > > >> index badff3611a98..6c470d584bf9 100644
> >> > > >> --- a/Documentation/devicetree/bindings/mfd/sun4i-gpadc.txt
> >> > > >> +++ b/Documentation/devicetree/bindings/mfd/sun4i-gpadc.txt
> >> > > >> @@ -4,12 +4,26 @@ The Allwinner SoCs all have an ADC that can
> >also
> >> > > >act as a thermal sensor
> >> > > >> and sometimes as a touchscreen controller.
> >> > > >>
> >> > > >> Required properties:
> >> > > >> - - compatible: "allwinner,sun8i-a33-ths",
> >> > > >> + - compatible: must contain one of the following
> >compatibles:
> >> > > >> + - "allwinner,sun8i-a33-ths"
> >> > > >> + - "allwinner,sun8i-h3-ths"
> >> > > >> - reg: mmio address range of the chip,
> >> > > >> - #thermal-sensor-cells: shall be 0,
> >> > > >> - #io-channel-cells: shall be 0,
> >> > > >>
> >> > > >> -Example:
> >> > > >> +Optional properties:
> >> > > >> + - nvmem-cells: A phandle to the calibration data provided
> >by a
> >> > > >nvmem device.
> >> > > >> + If unspecified default values shall be used.
> >> > > >> + - nvmem-cell-names: Should be "calibration-data"
> >> > > >
> >> > > >I'd prefer to have which sensor it applies to here. It wouldn't
> >change
> >> > > >anything for the H3, but it definitely does for example for the
> >A83t
> >> > > >that has two sensors, one for each cluster, and one for the GPU,
> >each
> >> > > >with calibration data.
> >> > > >
> >> > > >What about cluster0-calibration?
> >>
> >> I prefer sensor0-calibration to sensor3-calibration now.
> >> (Theortically the new generation THS can support up to 4 sensors)
> >
> >The mapping that explains what sensor0 means can change in the
> >future. It's better to be explicit here, and just say upfront what
> >it's about.
>
> I think for some SoC (e.g. A64) there's no clear explain on
> the functions of the sensors.
It's documented in the user manual ("sensor0 located in the CPU, sensor1 and
sensor2 located in the GPU"
> In addition, in the THS controller the sensors has a explicit
> sequence, and when referencing it in the DT the number is still
> needed (in thermal zones).
Yes, but that's something that can be made easier through defines too.
Maxime
--
Maxime Ripard, Free Electrons
Embedded Linux and Kernel engineering
http://free-electrons.com
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