On Fri, 2017-08-11 at 08:27 +0200, Heiko Stuebner wrote: > Hi, > > Am Freitag, 11. August 2017, 12:51:35 CEST schrieb Zhang Rui: > > > > On Fri, 2017-08-04 at 16:06 +0800, Rocky Hao wrote: > > > > > > This series patches add the tsadc support in thermal driver and > > > in > > > devicetree for rk3328. > > > Also add thermal control with Intelligent Power Allocation (IPA) > > > policy by default. Please > > > refer to https://developer.arm.com/open-source/intelligent-power- > > > allo > > > cation for more information > > > about IPA. > > > > > > Rocky Hao (5): > > > dt-bindings: rockchip-thermal: Support the RK3328 SoC > > > compatible > > > thermal: rockchip: Support the RK3328 SOC in thermal driver > > > arm64: dts: rockchip: add tsadc node for rk3328 SoC > > > arm64: dts: rockchip: add thermal nodes for rk3328 SoC > > > arm64: dts: rockchip: Enable tsadc module on RK3328 eavluation > > > board > > > > > I can take this patch set if we have ACK for patch 3, 4 and 5. > I would prefer if you would just apply patches 1+2 alone and I'd take > the devicetree patches through my tree. > > Having devicetree stuff mingle in a lot of trees produces unnecessary > conflicts, so the general best practice is having code + binding.txt > going through the driver tree and devicetree stuff through the > platform > tree. > OKay, I will take patch 1 and 2 and queue them for next merge window. thanks, rui > > Thanks > Heiko > -- To unsubscribe from this list: send the line "unsubscribe devicetree" in the body of a message to majordomo@xxxxxxxxxxxxxxx More majordomo info at http://vger.kernel.org/majordomo-info.html
