Re: [PATCH 2/4] dt-bindings: iio: humidity: Add bindings for HTU21 and MS8607 sensors

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On Wed, Jun 21, 2017 at 2:40 PM, Jonathan Cameron <jic23@xxxxxxxxxx> wrote:
> On Sun, 18 Jun 2017 09:05:11 -0500
> Rob Herring <robh@xxxxxxxxxx> wrote:
>
>> On Tue, Jun 13, 2017 at 10:50:43PM +0530, Manivannan Sadhasivam wrote:
>> > Add device tree bindings for Measurement-Specialties HTU21 temperature & humidity sensor and humidity part of MS8607 sensor
>> >
>> > Signed-off-by: Manivannan Sadhasivam <manivannan.sadhasivam@xxxxxxxxxx>
>> > ---
>> >  Documentation/devicetree/bindings/iio/humidity/htu21.txt | 13 +++++++++++++
>> >  1 file changed, 13 insertions(+)
>> >  create mode 100644 Documentation/devicetree/bindings/iio/humidity/htu21.txt
>> >
>> > diff --git a/Documentation/devicetree/bindings/iio/humidity/htu21.txt b/Documentation/devicetree/bindings/iio/humidity/htu21.txt
>> > new file mode 100644
>> > index 0000000..97d7963
>> > --- /dev/null
>> > +++ b/Documentation/devicetree/bindings/iio/humidity/htu21.txt
>> > @@ -0,0 +1,13 @@
>> > +*HTU21 - Measurement-Specialties htu21 temperature & humidity sensor and humidity part of MS8607 sensor
>>
>> The binding should be for the device, not part of it. You should bind
>> to a driver for MS8607 and then create 2 child devices for the humidity
>> and temp sensors.
> Hi Rob,
>
> It's a bit of an oddity as we are look at package in package parts.
> Really there are simply two parts here. There is no need to know
> they are in the same package.  Obviously we 'could' describe this, but
> it's no different form  mounting the chips next to each other on the
> same bus sharing the same power rails.

Okay, then it is fine as-is.

Rob
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