Re: [PATCH 1/3] dt-bindings: Document the hi3660 thermal sensor bindings

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e( 2017/6/20 18:27, Wei Xu ei:
Hi Tao,

On 2017/6/20 4:40, Tao Wang wrote:
This adds documentation of device tree bindings for the
thermal sensor controller of hi3660 SoC.

Signed-off-by: Tao Wang <kevin.wangtao@xxxxxxxxxxxxx>
---
  .../devicetree/bindings/thermal/hi3660-thermal.txt |   17 +++++++++++++++++
  1 file changed, 17 insertions(+)
  create mode 100644 Documentation/devicetree/bindings/thermal/hi3660-thermal.txt

diff --git a/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt b/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt
new file mode 100644
index 0000000..c034670
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt
@@ -0,0 +1,17 @@
+* Temperature Sensor on hisilicon hi3660 SoC
+
+** Required properties :
+
+- compatible: "hisilicon,thermal-hi3660".

It is better to put the SoC name before the function string.
ok, I will fix it, thank you.

BR,
Wei

+- reg: physical base address of thermal sensor and length of memory mapped
+  region.
+- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description.
+
+Example :
+
+	tsensor: tsensor {
+		compatible = "hisilicon,thermal-hi3660";
+		reg = <0x0 0xfff30000 0x0 0x1000>;
+		#thermal-sensor-cells = <1>;
+		status = "ok";
+	 };



.


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