Re: [PATCH 1/8] [RFC] dt-bindings: renesas: Document R-Car H3 and M3-W SiP DT bindings

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On Wed, Apr 19, 2017 at 11:15:44AM +0200, Geert Uytterhoeven wrote:
> Document the SiP ("System-in-Package") versions of the R-Car H3 and M3-W
> SoCs, which contain an R-Car H3 or M3-W SoC, RAM, and HyperFlash.
> 
> Add their compatible values to all boards equipped with R-Car Gen3 SiPs.
> 
> Signed-off-by: Geert Uytterhoeven <geert+renesas@xxxxxxxxx>
> ---
> Questions:
>   - Do we need more compatible values, for different configurations?
>     At least r8j7796 is available with either 2 GiB or 4 GiB of RAM,
>     possibly using RAM parts from different vendors.

Same die, just a different package? If so, I don't think you need a 
different compatible. It's going to be a different board from any 
non-SiP which should be enough to distinguish.

Rob
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