Re: [PATCH v6 03/11] dt-bindings: perf: hisi: Add Devicetree bindings for Hisilicon SoC PMU

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On Tuesday 21 March 2017 10:58 PM, Mark Rutland wrote:
On Tue, Mar 21, 2017 at 02:07:42PM +0000, Mark Rutland wrote:
On Fri, Mar 10, 2017 at 01:27:27AM -0500, Anurup M wrote:
+HiSilicon SoC chip is encapsulated by multiple CPU and IO dies. The CPU die
+is called as Super CPU cluster (SCCL) which includes 16 cpu-cores. Every SCCL
+in HiP05/06/07 chips are further grouped as CPU clusters (CCL) which includes
+4 cpu-cores each.
+e.g. In the case of HiP05/06/07, each SCCL has 1 L3 cache and 1 MN PMU device.
+The L3 cache is further grouped as 4 L3 cache banks in a SCCL.
+
+The Hisilicon SoC PMU DT node bindings for uncore PMU devices are as below.
+For PMU devices like L3 cache. MN etc. which are accessed using the djtag,
+the parent node will be the djtag node of the corresponding CPU die (SCCL).
+
+L3 cache
+---------
+The L3 cache is dedicated for each SCCL. Each SCCL in HiP05/06/07 chips have 4
+L3 cache banks. Each L3 cache bank have separate DT nodes.
+
+Required properties:
+
+	- compatible : This value should be as follows
+		(a) "hisilicon,hip05-pmu-l3c-v1" for v1 hw in HiP05 chipset
+		(b) "hisilicon,hip06-pmu-l3c-v1" for v1 hw in HiP06 chipset
+		(c) "hisilicon,hip07-pmu-l3c-v2" for v2 hw in HiP07 chipset
+
+	- hisilicon,module-id : This property is a combination of two values
+	    in the below order.
+		a) Module ID: The module identifier for djtag.
+		b) Instance or Bank ID: This will identify the L3 cache bank
+		 or instance.
I take it this is intended two mean this property is two cells in
length, with one cell for each of the below.

This is a somewhat confusing proeprty given that the name only applies
to the first half of the value...
Please split this itno two properties, and have a hisilicon,instance-id
for the L3 nodes.

Sure. Shall add hisilicon,instance-id for L3 nodes.

Thanks,
Anurup

Thanks,
Mark.

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