Hello again Rui, On 25-11-2013 10:44, Eduardo Valentin wrote: > Hello Rui, > > Please consider the following changes for 3.14. It contains the work of > representing hardware thermal using device tree. It also contains > three examples on how to use the new representation on sensor devices, > using three different drivers to accomplish it. One driver is on thermal > subsystem, the TI SoC thermal, and the other two drivers are in hwmon > subsystem. I also included a change on cpu cooling device, which required > also a change on cpufreq-cpu0 driver. The change on this cooling device > still keeps in one piece its usage on different platforms. > > Because it is a controversial topic due to the lack of standards, and > because it touches different subsystems, it took way longer than I expected. > However, I've been discussing in different channels, and I believe I got > enough entropy now to go forward. We have acks from cpufreq folks (on ARM side) > and from hwmon folks too. Raphael W., Jean D. and Mark R. have also > reviewed this series. They agree with the core idea of the work. FYI, Mark R. also acked the work on device tree binding behalf. And after a couple of improvements on binding document suggested by Thomasz F. and Mark. R, I uploaded in the same branch the resulting series. Let me know if you have troubles pulling the series. > > It has been agreed that this is not the end of it. As I said I started > with only three examples, but there are other potential drivers to use > this API. So, I have agreed with Jean D., for instance, that this > series would be first step of the complete work. Next would be to check > other potential drivers to be converted and then validate the proposed > API. Currently the thermal framework would be polling for device > temperature, but we could implement a couple of call backs to setup > update rate, thresholds and hysteresis too, for instance. > > On the other hand, I don't think the principle and concept would break > after converting the remaining drivers. That is why I am sending this pull > request. > > Another point is, as you can see, there are several points in this pull > request that do not belong to thermal subsystem. It has been suggested > by Guenter R. that in such cases, it is recommended to send the complete > series via one single subsystem. Thus, I am sending via your queue. > > Lastly, I've also volunteered to maintain the upcoming thermal bindings. > Then, you can see I am adding thermal bindings to our MAINTAINERS entry too. > > > All best, > > The following changes since commit 86e0a0bdf81c2dfa2a5a258dbb52f49c40ebc197: > > Merge branches 'intel_powerclamp', 'tmon' and 'misc' of .git into next (2013-11-07 08:45:54 +0800) > > are available in the git repository at: > > > git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal.git next > > for you to fetch changes up to 14d653c8ffc85c4aea7e50baa9a3c198b4fcf9c5: > > MAINTAINERS: add thermal bindings entry in thermal domain (2013-11-25 10:19:12 -0400) > > ---------------------------------------------------------------- > Eduardo Valentin (20): > thermal: allow registering without .get_temp > thermal: introduce device tree parser > thermal: core: introduce thermal_of_cooling_device_register > thermal: cpu_cooling: introduce of_cpufreq_cooling_register > cpufreq: cpufreq-cpu0: add dt node parsing for cooling device properties > hwmon: lm75: expose to thermal fw via DT nodes > hwmon: tmp102: expose to thermal fw via DT nodes > thermal: ti-soc-thermal: use thermal DT infrastructure > arm: dts: add omap4 CPU thermal data > arm: dts: add omap4430 thermal data > arm: dts: add omap4460 thermal data > arm: dts: add cooling properties on omap4430 cpu node > arm: dts: add cooling properties on omap4460 cpu node > arm: dts: add omap5 GPU thermal data > arm: dts: add omap5 CORE thermal data > arm: dts: add omap5 thermal data > arm: dts: add cooling properties on omap5 cpu node > arm: dts: make OMAP443x bandgap node to belong to OCP > arm: dts: make OMAP4460 bandgap node to belong to OCP > MAINTAINERS: add thermal bindings entry in thermal domain > > .../devicetree/bindings/cpufreq/cpufreq-cpu0.txt | 7 + > .../devicetree/bindings/thermal/thermal.txt | 589 ++++++++++++++ > MAINTAINERS | 1 + > arch/arm/boot/dts/omap4-cpu-thermal.dtsi | 41 + > arch/arm/boot/dts/omap443x.dtsi | 23 +- > arch/arm/boot/dts/omap4460.dtsi | 29 +- > arch/arm/boot/dts/omap5-core-thermal.dtsi | 28 + > arch/arm/boot/dts/omap5-gpu-thermal.dtsi | 28 + > arch/arm/boot/dts/omap5.dtsi | 15 +- > drivers/cpufreq/Kconfig | 2 +- > drivers/cpufreq/cpufreq-cpu0.c | 16 + > drivers/hwmon/lm75.c | 35 +- > drivers/hwmon/tmp102.c | 19 + > drivers/thermal/Kconfig | 14 + > drivers/thermal/Makefile | 1 + > drivers/thermal/cpu_cooling.c | 56 +- > drivers/thermal/of-thermal.c | 849 +++++++++++++++++++++ > drivers/thermal/thermal_core.c | 77 +- > drivers/thermal/thermal_core.h | 9 + > drivers/thermal/ti-soc-thermal/ti-thermal-common.c | 77 +- > include/dt-bindings/thermal/thermal.h | 17 + > include/linux/cpu_cooling.h | 25 + > include/linux/thermal.h | 32 +- > 23 files changed, 1939 insertions(+), 51 deletions(-) > create mode 100644 Documentation/devicetree/bindings/thermal/thermal.txt > create mode 100644 arch/arm/boot/dts/omap4-cpu-thermal.dtsi > create mode 100644 arch/arm/boot/dts/omap5-core-thermal.dtsi > create mode 100644 arch/arm/boot/dts/omap5-gpu-thermal.dtsi > create mode 100644 drivers/thermal/of-thermal.c > create mode 100644 include/dt-bindings/thermal/thermal.h > -- > To unsubscribe from this list: send the line "unsubscribe linux-pm" in > the body of a message to majordomo@xxxxxxxxxxxxxxx > More majordomo info at http://vger.kernel.org/majordomo-info.html > > -- You have got to be excited about what you are doing. (L. Lamport) Eduardo Valentin
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