Use Intelligent Power Allocation (IPA) technical to add dynamic power model for binding CPU thermal zone. The power allocator governor allocates power budget to control CPU temperature. Power Allocator governor is able to keep SOC temperature within a defined temperature range to avoid SOC overheat and keep it's performance. mt8173-cpufreq.c need to register its' own power model with power allocator thermal governor, so that power allocator governor can allocates suitable power budget to control CPU temperature. Binding document is refer to this patchset https://lkml.org/lkml/2015/11/30/239 Change since V5: 1. Remove thermal sensor ID from phandles Change since V4: 1. Remove unnecessary error-checking for mt8173-cpufreq.c 2. Initializing variable capacitance with 0 Change since V3: 1. Remove static power model 2. Split V3's device tree in two for thermal zones and dynamic power models respectively Change since V2: 1. Move dynamic/static power model in device tree Change since V1: 1. Include mt8171.h and sort header file for mt8173.dtsi Dawei Chien (3): thermal: mediatek: Add cpu dynamic power cooling model. arm64: dts: mt8173: Add thermal zone node. arm64: dts: mt8173: Add dynamic power node. arch/arm64/boot/dts/mediatek/mt8173.dtsi | 47 ++++++++++++++++++++++++++++++ drivers/cpufreq/mt8173-cpufreq.c | 12 ++++++-- 2 files changed, 57 insertions(+), 2 deletions(-) -- 1.7.9.5 -- To unsubscribe from this list: send the line "unsubscribe devicetree" in the body of a message to majordomo@xxxxxxxxxxxxxxx More majordomo info at http://vger.kernel.org/majordomo-info.html
