On 22-10-15, 20:02, Dawei Chien wrote: > Use Intelligent Power Allocation (IPA) technical to add static/dynamic power model for binding CPU thermal zone. > The power allocator governor allocates power budget to control CPU temperature. > > Power Allocator governor is able to keep SOC temperature within a defined temperature range to avoid SOC overheat and keep it's performance. mt8173-cpufreq.c need to register its' own power model with power allocator thermal governor, so that power allocator governor can allocates suitable power budget to control CPU temperature. > > PATCH1 is base on > https://patchwork.kernel.org/patch/7034601/ > > PATCH2 is base on Sascha's thermal driver V9 > https://patchwork.kernel.org/patch/7249821/ > https://patchwork.kernel.org/patch/7249861/ > https://patchwork.kernel.org/patch/7249891/ > > Change since V1: > include mt8171.h and sort header file for mt8173.dtsi > > Change since V2: > Move dynamic/static power model in device tree > > Dawei.Chien (2): > thermal: mediatek: Add cpu power cooling model. > arm64: dts: mt8173: Add thermal zone node for mt8173. Sorry for being extremely late in reviewing this stuff. You are already on v3 and I haven't reviewed it once. Mostly due to bad timing of my holidays and other work pressure. Now, there are few things that I feel are not properly addressed here, and I may be wrong: - Where are the bindings for static-power-points and dynamic-power-coefficient. Sorry I failed to see them in this or other series you mentioned. - Even then, why should we be adding another table into DT for voltage/power ? And not reuse and extend the opp-v2 stuff which is already mainlined now. - There are few issues with the code as well, but I want to see where the bindings should go first. And then only discuss the code further. -- viresh -- To unsubscribe from this list: send the line "unsubscribe devicetree" in the body of a message to majordomo@xxxxxxxxxxxxxxx More majordomo info at http://vger.kernel.org/majordomo-info.html
