Re: Time to refresh my hardware

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On Sat, 12 Oct 2019 at 16:10, Samuel Sieb <samuel@xxxxxxxx> wrote:
On 10/12/19 5:42 AM, Sam Varshavchik wrote:
> George N. White III writes:
>
>> <URL:https://www.titancomputers.com/Titan-W299-Intel-Core-i9-SkyLake-Series-3D-CAD-p/w299.htm>https://www.titancomputers.com/Titan-W299-Intel-Core-i9-SkyLake-Series-3D-CAD-p/w299.htm
>>
>>
>> offers Fedora on Core i9 workstations.   They only sell the high end
>> i9's in a case with power
>> and cooling for multiple graphics cards.   For your needs that is
>> overkill, but most systems
>> with high-CPU's are used with multiple graphics cards.
>
> Looks like they do have some AMD systems, which appear to give more bang
> for the buck than Intel; but it's still overkill for me, with their
> liquid-cooled setup.

At work a couple of years ago, we built two computers for the science
people with dual 16-core AMD CPUs and there was no special cooling
needed for those.

There are benchmark results for a 32-core / 64-thread AMD Threadripper 2990WX 
"Besides the Cooler Master Threadripper heatsink, AMD also included the Enermax Liqtech TR4 240 with 
the Threadripper 2 review hardware."  The Enermax ran consistently cooler through the benchmarks.
There are plots of temperature over time that show all the coolers recovered quickly between 
iterations, but many of them showed a rising trend for the duration of the benchmark.   If you know 
your workload provides some idle periods then air-cooling seems practical.  If you do have the 
odd large task then thermal throttling will slow it down, but that may be an acceptable trade-off
for a built-by-user system.

Hardware vendors have to configure for demanding workloads heavy on both I/O and CPU and 
include the heat from a caseload of high-end HDD's.  SSD's help to reduce overall cooling
requirements.   

Liquid cooling generally simplifies airflow design issues.   The big vendors can afford lots of
testing and custom air ducts, etc. that you don't get with the average user build.

--
George N. White III

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